2020 21st International Conference on Electronic Packaging Technology (ICEPT)
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Published By IEEE

9781728168265
Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Simulation and Verification of Pressure Drop in Silicon Microchannel Based on Porous Model Equivalence

2020 ◽  
Author(s):  
Chuan Chen ◽  
Rui Ma ◽  
Fengze Hou ◽  
Meiying Su ◽  
Jun Li ◽  
...  
Keyword(s):  
Pressure Drop ◽  
Porous Model ◽  
Model Equivalence

Development of 3D Wafer Level Package for SAW Filters Using Thin Film Lamination

2020 ◽  
Author(s):  
Zuohuan Chen ◽  
Mingchuan Zhang ◽  
Kai Zhu ◽  
Feng Jiang ◽  
Daquan Yu
Keyword(s):  
Thin Film ◽  
Wafer Level ◽  
Wafer Level Package

The Intelligent Flow Control of LED Phosphor Powder Based on WPA-BPNN-PID Algorithm

2020 ◽  
Author(s):  
Yueming Hu ◽  
Zhilin Wang ◽  
Chuiming Wan ◽  
Zhaoming Zeng
Keyword(s):  
Flow Control ◽  
Phosphor Powder ◽  
Pid Algorithm

Anti-sulfidation treatment method of silver alloy bonding wire and application of LED pack silver

2020 ◽  
Author(s):  
Zhangqiao Zhou ◽  
Bin Yang ◽  
Li Chao ◽  
ChuMan Ho ◽  
Yu Zhang ◽  
...  
Keyword(s):  
Treatment Method ◽  
Silver Alloy ◽  
Bonding Wire

Simulation study f the selective soldering process of the electrical connector to Printed circle board

2020 ◽  
Author(s):  
Yuyan xiang ◽  
Xudong ning ◽  
Yuan yao ◽  
Xiaoyan zhan ◽  
Guoling liu ◽  
...  
Keyword(s):  
Simulation Study ◽  
Soldering Process ◽  
Electrical Connector

Dynamical Frequency Displacement Scheme for Fault-tolerant LLC Topology

2020 ◽  
Author(s):  
Chi Man CHENG ◽  
Tak Lok SHUM ◽  
Shek Mong WONG
Keyword(s):  
Fault Tolerant
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