2020 21st International Conference on Electronic Packaging Technology (ICEPT)
Latest Publications

TOTAL DOCUMENTS

351

(FIVE YEARS 351)

H-INDEX

(FIVE YEARS 1)

Published By IEEE

9781728168265

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Simulation and Verification of Pressure Drop in Silicon Microchannel Based on Porous Model Equivalence

2020 21st International Conference on Electronic Packaging Technology (ICEPT) ◽

10.1109/icept50128.2020.9202999 ◽

2020 ◽

Author(s):

Chuan Chen ◽

Rui Ma ◽

Fengze Hou ◽

Meiying Su ◽

Jun Li ◽

...

Keyword(s):

Pressure Drop ◽

Porous Model ◽

Model Equivalence

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A Study on the Joint Properties and Reliability of 25μm Cu/Ni/Sn-3.5Ag Bonding Process with Chip on Chip Thermal Compression Bonding

2020 21st International Conference on Electronic Packaging Technology (ICEPT) ◽

10.1109/icept50128.2020.9202998 ◽

2020 ◽

Author(s):

Chu Tang ◽

Wenhui Zhu ◽

Liancheng Wang ◽

Ganglong Li

Keyword(s):

Bonding Process ◽

Thermal Compression ◽

Joint Properties ◽

On Chip

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Development of 3D Wafer Level Package for SAW Filters Using Thin Film Lamination

2020 21st International Conference on Electronic Packaging Technology (ICEPT) ◽

10.1109/icept50128.2020.9202920 ◽

2020 ◽

Author(s):

Zuohuan Chen ◽

Mingchuan Zhang ◽

Kai Zhu ◽

Feng Jiang ◽

Daquan Yu

Keyword(s):

Thin Film ◽

Wafer Level ◽

Wafer Level Package

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Black equation of the electromigration lifetime for ceramic package with lead bumps and plastic package with lead-free bump

2020 21st International Conference on Electronic Packaging Technology (ICEPT) ◽

10.1109/icept50128.2020.9202871 ◽

2020 ◽

Author(s):

Si Chen ◽

Qiushi Wu ◽

Zhiwei Fu ◽

Yun Huang ◽

Bin Yao ◽

...

Keyword(s):

Lead Free ◽

Plastic Package ◽

Electromigration Lifetime

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The Intelligent Flow Control of LED Phosphor Powder Based on WPA-BPNN-PID Algorithm

2020 21st International Conference on Electronic Packaging Technology (ICEPT) ◽

10.1109/icept50128.2020.9202890 ◽

2020 ◽

Author(s):

Yueming Hu ◽

Zhilin Wang ◽

Chuiming Wan ◽

Zhaoming Zeng

Keyword(s):

Flow Control ◽

Phosphor Powder ◽

Pid Algorithm

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Cu/Sn Bonding Technology Research for Multi-layer Interposer

2020 21st International Conference on Electronic Packaging Technology (ICEPT) ◽

10.1109/icept50128.2020.9201940 ◽

2020 ◽

Author(s):

Peng Zhang ◽

Geng Fei ◽

Peng Sun

Keyword(s):

Technology Research ◽

Bonding Technology

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Anti-sulfidation treatment method of silver alloy bonding wire and application of LED pack silver

2020 21st International Conference on Electronic Packaging Technology (ICEPT) ◽

10.1109/icept50128.2020.9202913 ◽

2020 ◽

Author(s):

Zhangqiao Zhou ◽

Bin Yang ◽

Li Chao ◽

ChuMan Ho ◽

Yu Zhang ◽

...

Keyword(s):

Treatment Method ◽

Silver Alloy ◽

Bonding Wire

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Simulation study f the selective soldering process of the electrical connector to Printed circle board

2020 21st International Conference on Electronic Packaging Technology (ICEPT) ◽

10.1109/icept50128.2020.9201906 ◽

2020 ◽

Author(s):

Yuyan xiang ◽

Xudong ning ◽

Yuan yao ◽

Xiaoyan zhan ◽

Guoling liu ◽

...

Keyword(s):

Simulation Study ◽

Soldering Process ◽

Electrical Connector

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Dynamical Frequency Displacement Scheme for Fault-tolerant LLC Topology

2020 21st International Conference on Electronic Packaging Technology (ICEPT) ◽

10.1109/icept50128.2020.9201928 ◽

2020 ◽

Author(s):

Chi Man CHENG ◽

Tak Lok SHUM ◽

Shek Mong WONG

Keyword(s):

Fault Tolerant

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The Effects of Polymer-Based Packaging Materials Defects on the Corrosion Resistance of Electronic Components

2020 21st International Conference on Electronic Packaging Technology (ICEPT) ◽

10.1109/icept50128.2020.9202990 ◽

2020 ◽

Author(s):

Yanhuang Tang ◽

Huanxiang Xu ◽

Peiqiang Zhang

Keyword(s):

Corrosion Resistance ◽

Packaging Materials ◽

Electronic Components

Download Full-text

2020 21st International Conference on Electronic Packaging Technology (ICEPT)Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Simulation and Verification of Pressure Drop in Silicon Microchannel Based on Porous Model Equivalence

A Study on the Joint Properties and Reliability of 25μm Cu/Ni/Sn-3.5Ag Bonding Process with Chip on Chip Thermal Compression Bonding

Development of 3D Wafer Level Package for SAW Filters Using Thin Film Lamination

Black equation of the electromigration lifetime for ceramic package with lead bumps and plastic package with lead-free bump

The Intelligent Flow Control of LED Phosphor Powder Based on WPA-BPNN-PID Algorithm

Cu/Sn Bonding Technology Research for Multi-layer Interposer

Anti-sulfidation treatment method of silver alloy bonding wire and application of LED pack silver

Simulation study f the selective soldering process of the electrical connector to Printed circle board

Dynamical Frequency Displacement Scheme for Fault-tolerant LLC Topology

The Effects of Polymer-Based Packaging Materials Defects on the Corrosion Resistance of Electronic Components

2020 21st International Conference on Electronic Packaging Technology (ICEPT)
Latest Publications