2020 21st International Conference on Electronic Packaging Technology (ICEPT)
Latest Publications

TOTAL DOCUMENTS

351

(FIVE YEARS 351)

H-INDEX

1

(FIVE YEARS 1)

Published By IEEE

9781728168265

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Cu/Sn Bonding Technology Research for Multi-layer Interposer

2020 21st International Conference on Electronic Packaging Technology (ICEPT) ◽

10.1109/icept50128.2020.9201940 ◽

2020 ◽

Author(s):

Peng Zhang ◽

Geng Fei ◽

Peng Sun

Keyword(s):

Technology Research ◽

Bonding Technology

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Anti-sulfidation treatment method of silver alloy bonding wire and application of LED pack silver

2020 21st International Conference on Electronic Packaging Technology (ICEPT) ◽

10.1109/icept50128.2020.9202913 ◽

2020 ◽

Author(s):

Zhangqiao Zhou ◽

Bin Yang ◽

Li Chao ◽

ChuMan Ho ◽

Yu Zhang ◽

...

Keyword(s):

Treatment Method ◽

Silver Alloy ◽

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Simulation study f the selective soldering process of the electrical connector to Printed circle board

2020 21st International Conference on Electronic Packaging Technology (ICEPT) ◽

10.1109/icept50128.2020.9201906 ◽

2020 ◽

Author(s):

Yuyan xiang ◽

Xudong ning ◽

Yuan yao ◽

Xiaoyan zhan ◽

Guoling liu ◽

...

Keyword(s):

Simulation Study ◽

Soldering Process ◽

Electrical Connector

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Dynamical Frequency Displacement Scheme for Fault-tolerant LLC Topology

2020 21st International Conference on Electronic Packaging Technology (ICEPT) ◽

10.1109/icept50128.2020.9201928 ◽

2020 ◽

Author(s):

Chi Man CHENG ◽

Tak Lok SHUM ◽

Shek Mong WONG

Keyword(s):

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The Effects of Polymer-Based Packaging Materials Defects on the Corrosion Resistance of Electronic Components

2020 21st International Conference on Electronic Packaging Technology (ICEPT) ◽

10.1109/icept50128.2020.9202990 ◽

2020 ◽

Author(s):

Yanhuang Tang ◽

Huanxiang Xu ◽

Peiqiang Zhang

Keyword(s):

Corrosion Resistance ◽

Packaging Materials ◽

Electronic Components

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Giant Permittivity in Polyvinylidene Fluoride Composites Filled with Flower-Like BaTiO3 for Energy Storage

2020 21st International Conference on Electronic Packaging Technology (ICEPT) ◽

10.1109/icept50128.2020.9202539 ◽

2020 ◽

Author(s):

Gang Jian ◽

Yong Jiao ◽

Qingzhen Meng ◽

C.P. Wong

Keyword(s):

Energy Storage ◽

Polyvinylidene Fluoride

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Study on the Effect of Sintering Process on Copper Nanoparticles

2020 21st International Conference on Electronic Packaging Technology (ICEPT) ◽

10.1109/icept50128.2020.9202554 ◽

2020 ◽

Author(s):

Ping Cao ◽

Yu. Zhang ◽

Guannan. Yang ◽

Bin. Yang ◽

Shiwo. Ta ◽

...

Keyword(s):

Copper Nanoparticles ◽

Sintering Process

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Fault diagnosis of electronic manufacturing system based on probabilistic neural network

2020 21st International Conference on Electronic Packaging Technology (ICEPT) ◽

10.1109/icept50128.2020.9202960 ◽

2020 ◽

Author(s):

Wei Wei ◽

Chunyue Huang ◽

Ying Liang ◽

Jun Xie ◽

Shoufu Liu

Keyword(s):

Neural Network ◽

Fault Diagnosis ◽

Manufacturing System ◽

Probabilistic Neural Network ◽

Electronic Manufacturing

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Life Prediction and Verification of Energy Meter Based on Multi-stress Influence Weibull Distribution Model

2020 21st International Conference on Electronic Packaging Technology (ICEPT) ◽

10.1109/icept50128.2020.9202443 ◽

2020 ◽

Author(s):

Jiangming ZHANG ◽

Li YAO ◽

Jifan LV ◽

Linna NI ◽

Jian YUAN ◽

...

Keyword(s):

Weibull Distribution ◽

Life Prediction ◽

Distribution Model ◽

Energy Meter ◽

Stress Influence

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Study on Direct Current Cu Electroplating in Through Ceramic Holes for High-power LED Packaging

2020 21st International Conference on Electronic Packaging Technology (ICEPT) ◽

10.1109/icept50128.2020.9202962 ◽

2020 ◽

Author(s):

Qing Wang ◽

Tianwen Cheng ◽

Fangkang Chen ◽

Mingxiang Cheng

Keyword(s):

Direct Current ◽

Cu Electroplating ◽

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