Cu/Sn Bonding Technology Research for Multi-layer Interposer

2020 21st International Conference on Electronic Packaging Technology (ICEPT) ◽

10.1109/icept50128.2020.9201940 ◽

2020 ◽

Author(s):

Peng Zhang ◽

Geng Fei ◽

Peng Sun

Keyword(s):

Technology Research ◽

Bonding Technology

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$\text{SiO}_{2}/\text{SiO}_{2}$ Bonding Technology Research on Wafer-level 3D Stacking

10.1109/icept52650.2021.9568204 ◽

2021 ◽

Author(s):

Zhang Peng ◽

Chengyu Yu ◽

Kai Cen ◽

Jie Pu ◽

Pengcheng Xia ◽

...

Keyword(s):

Technology Research ◽

Wafer Level ◽

Bonding Technology ◽

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National rehabilitation hospital assistive technology research center

PsycEXTRA Dataset ◽

10.1037/e443752005-001 ◽

1997 ◽

Author(s):

John Toerge

Keyword(s):

Assistive Technology ◽

Research Center ◽

Technology Research ◽

Rehabilitation Hospital

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Assistive Technology Research Center

PsycEXTRA Dataset ◽

10.1037/e447162006-001 ◽

2001 ◽

Author(s):

John Toerge ◽

Joseph Bleiberg ◽

Michael Rose

Keyword(s):

Assistive Technology ◽

Research Center ◽

Technology Research

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Tokyo Metropolitan Industrial Technology Research Institute; Development of Industry, Improvement of the Lives of Metropolitan Area Residents

The Journal of the Institute of Electrical Engineers of Japan ◽

10.1541/ieejjournal.139.728 ◽

2019 ◽

Vol 139 (11) ◽

pp. 728-729

Author(s):

Satoshi MATSUMOTO ◽

Bezawit Mekonnen Getahun ◽

Khairiah Binti Mohamad Radzi

Keyword(s):

Metropolitan Area ◽

Industrial Technology ◽

Technology Research ◽

Tokyo Metropolitan ◽

Industrial Technology Research Institute ◽

Research Institute

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Multidomain technology research on computer network applications

Future Information Engineering ◽

10.2495/icie131052 ◽

2014 ◽

Author(s):

Jianning Yang ◽

Kun Lin

Keyword(s):

Computer Network ◽

Technology Research ◽

Network Applications

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Exploring the university-industry-government high technology research triad: public policy ramifications of biotechnology

10.31274/rtd-180813-9410 ◽

1990 ◽

Author(s):

Brian Josef Reichel

Keyword(s):

Public Policy ◽

High Technology ◽

Technology Research ◽

The University ◽

University Industry

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A Survey of Enhanced Publication Features of China’s Science and Technology Research Journals in 2018

Journal of Scholarly Publishing ◽

10.3138/jsp.50.4.03 ◽

2019 ◽

Vol 50 (4) ◽

pp. 265-278

Author(s):

Qing Fang ◽

Lijuan Zhan ◽

Wei Peng

Keyword(s):

Science And Technology ◽

Technology Research

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Fine-pitch bonding technology with surface planarized solder micro-bump/polymer hybrid for 3D integration

Japanese Journal of Applied Physics ◽

10.35848/1347-4065/abd69c ◽

2020 ◽

Author(s):

Fumihiro Inoue ◽

Jaber Derakhshandeh ◽

Melina Lofrano ◽

Eric Beyne

Keyword(s):

3D Integration ◽

Polymer Hybrid ◽

Bonding Technology

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Data exchanging technology research of intelligent measuring and control system based on IEEE1451

Journal of Computer Applications ◽

10.3724/sp.j.1087.2013.01183 ◽

2013 ◽

Vol 33 (4) ◽

pp. 1183-1186

Author(s):

Tingdong YE ◽

Guojian HUANG ◽

Xiaobin HONG

Keyword(s):

Control System ◽

Technology Research ◽

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High Performance Computing Support for Advanced Radar Technology Research Consortium

10.21236/ada398230 ◽

2001 ◽

Author(s):

Donald J. Fabozzi ◽

Barney II ◽

Fugler Blaise ◽

Koligman Joe ◽

Jackett Mike ◽

...

Keyword(s):

High Performance Computing ◽

High Performance ◽

Technology Research ◽

Research Consortium ◽

Computing Support ◽

Performance Computing

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