2012 14th International Conference on Electronic Materials and Packaging (EMAP)
Latest Publications

TOTAL DOCUMENTS

102

(FIVE YEARS 0)

H-INDEX

(FIVE YEARS 0)

Published By IEEE

9781467349451, 9781467349444

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Color consistence improvement in LED packages

2012 14th International Conference on Electronic Materials and Packaging (EMAP) ◽

10.1109/emap.2012.6507883 ◽

2012 ◽

Author(s):

Cell K.Y. Wong ◽

Stanley Y.Y. Leung ◽

Lin Niu ◽

Gongqi Fan ◽

Xiang Zhou ◽

...

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High bright white LED packaging systems using unique vacuum printing technology (VPES)

2012 14th International Conference on Electronic Materials and Packaging (EMAP) ◽

10.1109/emap.2012.6507887 ◽

2012 ◽

Author(s):

Atsushi Okuno ◽

Yoshiteru Miyawaki ◽

Dongxu Wang ◽

Osamu Tanaka

Keyword(s):

White Led ◽

Printing Technology

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Warpage, stresses and KOZ of 3D TSV DRAM package during manufacturing processes

2012 14th International Conference on Electronic Materials and Packaging (EMAP) ◽

10.1109/emap.2012.6507849 ◽

2012 ◽

Cited By ~ 1

Author(s):

P. S. Huang ◽

M. Y. Tsai ◽

C. Y. Huang ◽

P. C. Lin ◽

Lawrence Huang ◽

...

Keyword(s):

Manufacturing Processes

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The evolution of IMCs' morphologies and types in SAC and SAC+ solder bumps during thermal shock process

2012 14th International Conference on Electronic Materials and Packaging (EMAP) ◽

10.1109/emap.2012.6507861 ◽

2012 ◽

Author(s):

Ying Zhong ◽

Chun Qing Wang ◽

J.F.J.M. Caers ◽

Xiujuan Zhao

Keyword(s):

Thermal Shock ◽

Shock Process ◽

Solder Bumps ◽

Sac Solder

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Molding void issue and solution of a Package-in-Package

2012 14th International Conference on Electronic Materials and Packaging (EMAP) ◽

10.1109/emap.2012.6507871 ◽

2012 ◽

Author(s):

Yu Chen ◽

Jian Cai ◽

Mian Huang ◽

Guanqiang Song ◽

Jing Jiang ◽

...

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Packaging of microelectronics for thermo-mechanical environments

2012 14th International Conference on Electronic Materials and Packaging (EMAP) ◽

10.1109/emap.2012.6507910 ◽

2012 ◽

Cited By ~ 1

Author(s):

Ming-Han Wang ◽

Mei-Ling Wu

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Generation of arbitrary vector beams with a spatial light modulator

2012 14th International Conference on Electronic Materials and Packaging (EMAP) ◽

10.1109/emap.2012.6507841 ◽

2012 ◽

Author(s):

Mengnan Zhao ◽

Xiangsheng Xie

Keyword(s):

Spatial Light Modulator ◽

Arbitrary Vector ◽

Light Modulator ◽

Vector Beams

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Carbon nanotubes based composites with high dielectric constant and low loss

2012 14th International Conference on Electronic Materials and Packaging (EMAP) ◽

10.1109/emap.2012.6507894 ◽

2012 ◽

Author(s):

Imtiaz Madni ◽

Shuhui Yu ◽

Rong Sun

Keyword(s):

Carbon Nanotubes ◽

Dielectric Constant ◽

High Dielectric Constant ◽

Low Loss ◽

High Dielectric

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Transparent functionalized zinc oxide/epoxy nanocomposite with high thermal performance for high-power light-emitting diodes

2012 14th International Conference on Electronic Materials and Packaging (EMAP) ◽

10.1109/emap.2012.6507891 ◽

2012 ◽

Author(s):

Min Zhang ◽

Kai Zhang ◽

Xinfeng Zhang ◽

Chen Yang ◽

Matthew Ming-Fai Yuen

Keyword(s):

Zinc Oxide ◽

Thermal Performance ◽

High Power ◽

Light Emitting Diodes ◽

Light Emitting ◽

Epoxy Nanocomposite

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Potential-assisted assembly of thiol-based materials for reliable copper-epoxy interface

2012 14th International Conference on Electronic Materials and Packaging (EMAP) ◽

10.1109/emap.2012.6507832 ◽

2012 ◽

Author(s):

Stephen C.T. Kwok ◽

Matthew M.F. Yuen

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2012 14th International Conference on Electronic Materials and Packaging (EMAP)Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Color consistence improvement in LED packages

High bright white LED packaging systems using unique vacuum printing technology (VPES)

Warpage, stresses and KOZ of 3D TSV DRAM package during manufacturing processes

The evolution of IMCs' morphologies and types in SAC and SAC+ solder bumps during thermal shock process

Molding void issue and solution of a Package-in-Package

Packaging of microelectronics for thermo-mechanical environments

Generation of arbitrary vector beams with a spatial light modulator

Carbon nanotubes based composites with high dielectric constant and low loss

Transparent functionalized zinc oxide/epoxy nanocomposite with high thermal performance for high-power light-emitting diodes

Potential-assisted assembly of thiol-based materials for reliable copper-epoxy interface

2012 14th International Conference on Electronic Materials and Packaging (EMAP)
Latest Publications