2012 14th International Conference on Electronic Materials and Packaging (EMAP)
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9781467349451, 9781467349444
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Silicon substrate with TSV for light emitting diode packaging

2012 ◽  
Author(s):  
Zhicheng Lv ◽  
Xiaogang Liu ◽  
Liang Yang ◽  
Jiaojiao Yuan ◽  
Xuefang Wang ◽  
...  
Keyword(s):  
Silicon Substrate ◽  
Light Emitting Diode ◽  
Light Emitting

Electrochemical deposition of Galfenol

2012 ◽  
Author(s):  
Robert W. Kay ◽  
Jack Hoyd-Gigg Ng ◽  
Chris Popov ◽  
Paul Record ◽  
Marc P. Y. Desmulliez
Keyword(s):  
Electrochemical Deposition

An investigation on secondary EFO copper wire - from a nanoscale perspective view

2012 ◽  
Author(s):  
Hsiang-Chen Hsu ◽  
Jih-Hsin Chien ◽  
Chen-Yi Wang ◽  
Cheng-Che Liu ◽  
Shen-Li Fu ◽  
...  
Keyword(s):  
Copper Wire ◽  
Perspective View

Molding void issue and solution of a Package-in-Package

2012 ◽  
Author(s):  
Yu Chen ◽  
Jian Cai ◽  
Mian Huang ◽  
Guanqiang Song ◽  
Jing Jiang ◽  
...  
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