2019 IEEE 23rd Workshop on Signal and Power Integrity (SPI)
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9781538683422
Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Thermal and Signal Integrity Analysis of Novel 3D Crossbar Resistive Random Access Memories

2019 ◽  
Author(s):  
F. Zayer ◽  
K. Lahbacha ◽  
W. Dghais ◽  
H. Belgacem ◽  
Massimiliano de Magistris ◽  
...  
Keyword(s):  
Signal Integrity ◽  
Random Access ◽  
Integrity Analysis

Use of Multilayered-PCB for Q-band Substrate Integrated Waveguide Components

2019 ◽  
Author(s):  
Abbas El Mostrah ◽  
Alexandre Manchec ◽  
Yann Clavet ◽  
Mathieu Cariou ◽  
Miguel Sanchez-Soriano ◽  
...  
Keyword(s):  
Substrate Integrated Waveguide ◽  
Waveguide Components

Frequency-Domain Characterization of Power Inductors for Class-E Resonant Converters

2019 ◽  
Author(s):  
Josip Bacmaga ◽  
Raul Blecic ◽  
Fabio Pareschi ◽  
Riccardo Rovatti ◽  
Gianluca Setti ◽  
...  
Keyword(s):  
Frequency Domain ◽  
Resonant Converters ◽  
Power Inductors ◽  
Class E
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