Proceedings of Japan International Electronic Manufacturing Technology Symposium
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Planarization Process Of Copper-polyimide Thin Film Multilayer Substrate

2005 ◽  
Author(s):  
Y. Kasuya ◽  
Y. Takahashi ◽  
Y. Uno ◽  
Y. Iguchi ◽  
T. Kanamori
Keyword(s):  
Thin Film ◽  
Planarization Process ◽  
Multilayer Substrate

Small-sized 10-gbit/s Optical Transmitter And Receiver Modules Including 8-bit Mux/demux Ics

2005 ◽  
Author(s):  
T. Umeda ◽  
K. Kaminishi ◽  
E. Takagi ◽  
J. Hanari ◽  
A. Tohdake ◽  
...  
Keyword(s):  
Optical Transmitter

A Stud-bump-bonding Technique For High Density Multi-chip-module

2005 ◽  
Author(s):  
Y. Bessho ◽  
Y. Tomura ◽  
Y. Hakotani ◽  
M. Tsukamoto ◽  
T. Ishlda ◽  
...  
Keyword(s):  
High Density ◽  
Bonding Technique

Fine Pitch And High Lead Count Multilayer Ceramic Qfp

2005 ◽  
Author(s):  
Y. Nakatsuka ◽  
T. Yamamoto ◽  
Y. Morita ◽  
M. Fujii ◽  
H. Ohtani ◽  
...  
Keyword(s):  
Fine Pitch ◽  
Multilayer Ceramic ◽  
High Lead

I/O Pin Solder Point Inspection System

2005 ◽  
Author(s):  
T. Koezuka ◽  
Y. Suto ◽  
M. Ando
Keyword(s):  
Inspection System ◽  
Point Inspection

Fine Pitch Tab-lsi Interconnection Technology In MCM

2005 ◽  
Author(s):  
F. Mori ◽  
K. Kudo ◽  
K. Tsukamoto
Keyword(s):  
Fine Pitch
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