Proceedings of Japan International Electronic Manufacturing Technology Symposium
Latest Publications

TOTAL DOCUMENTS

(FIVE YEARS 0)

H-INDEX

(FIVE YEARS 0)

Published By IEEE

0780314328

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Planarization Process Of Copper-polyimide Thin Film Multilayer Substrate

Proceedings of Japan International Electronic Manufacturing Technology Symposium ◽

10.1109/iemt.1993.639284 ◽

2005 ◽

Author(s):

Y. Kasuya ◽

Y. Takahashi ◽

Y. Uno ◽

Y. Iguchi ◽

T. Kanamori

Keyword(s):

Thin Film ◽

Planarization Process ◽

Multilayer Substrate

Get full-text (via PubEx)

Thermally Conductive Circuit Board Using Anodized Aluminum And Polymer Thick Film

Proceedings of Japan International Electronic Manufacturing Technology Symposium ◽

10.1109/iemt.1993.639352 ◽

2005 ◽

Author(s):

K. Takeda ◽

Y. Uematsu

Keyword(s):

Thick Film ◽

Circuit Board ◽

Anodized Aluminum ◽

Thermally Conductive

Get full-text (via PubEx)

Small-sized 10-gbit/s Optical Transmitter And Receiver Modules Including 8-bit Mux/demux Ics

Proceedings of Japan International Electronic Manufacturing Technology Symposium ◽

10.1109/iemt.1993.639816 ◽

2005 ◽

Author(s):

T. Umeda ◽

K. Kaminishi ◽

E. Takagi ◽

J. Hanari ◽

A. Tohdake ◽

...

Keyword(s):

Optical Transmitter

Get full-text (via PubEx)

A Stud-bump-bonding Technique For High Density Multi-chip-module

Proceedings of Japan International Electronic Manufacturing Technology Symposium ◽

10.1109/iemt.1993.639807 ◽

2005 ◽

Cited By ~ 14

Author(s):

Y. Bessho ◽

Y. Tomura ◽

Y. Hakotani ◽

M. Tsukamoto ◽

T. Ishlda ◽

...

Keyword(s):

High Density ◽

Bonding Technique

Get full-text (via PubEx)

On Chip Digital Output Semiconductor Sensor Employing Cmos Inverter Array

Proceedings of Japan International Electronic Manufacturing Technology Symposium ◽

10.1109/iemt.1993.639763 ◽

2005 ◽

Author(s):

A. Kasamatsu ◽

Bom-yun Kim ◽

K. Shono

Keyword(s):

Cmos Inverter ◽

Digital Output ◽

Semiconductor Sensor ◽

On Chip

Get full-text (via PubEx)

Fine Pitch And High Lead Count Multilayer Ceramic Qfp

Proceedings of Japan International Electronic Manufacturing Technology Symposium ◽

10.1109/iemt.1993.639744 ◽

2005 ◽

Author(s):

Y. Nakatsuka ◽

T. Yamamoto ◽

Y. Morita ◽

M. Fujii ◽

H. Ohtani ◽

...

Keyword(s):

Fine Pitch ◽

Multilayer Ceramic ◽

High Lead

Get full-text (via PubEx)

I/O Pin Solder Point Inspection System

Proceedings of Japan International Electronic Manufacturing Technology Symposium ◽

10.1109/iemt.1993.639760 ◽

2005 ◽

Author(s):

T. Koezuka ◽

Y. Suto ◽

M. Ando

Keyword(s):

Inspection System ◽

Point Inspection

Get full-text (via PubEx)

Fine Pitch Tab-lsi Interconnection Technology In MCM

Proceedings of Japan International Electronic Manufacturing Technology Symposium ◽

10.1109/iemt.1993.639808 ◽

2005 ◽

Author(s):

F. Mori ◽

K. Kudo ◽

K. Tsukamoto

Keyword(s):

Fine Pitch

Get full-text (via PubEx)

Applications And Technology For Laminate Multicihip Modules

Proceedings of Japan International Electronic Manufacturing Technology Symposium ◽

10.1109/iemt.1993.639738 ◽

2005 ◽

Author(s):

R.T. Crowley ◽

E.J. Vardaman

Get full-text (via PubEx)

Whisker Reinforced Copper / Glass-ceramic Multilayer Substrate

Proceedings of Japan International Electronic Manufacturing Technology Symposium ◽

10.1109/iemt.1993.639758 ◽

2005 ◽

Author(s):

K. Ikuina ◽

M. Kimura ◽

K. Utsumi

Keyword(s):

Glass Ceramic ◽

Multilayer Substrate

Get full-text (via PubEx)

Proceedings of Japan International Electronic Manufacturing Technology SymposiumLatest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Planarization Process Of Copper-polyimide Thin Film Multilayer Substrate

Thermally Conductive Circuit Board Using Anodized Aluminum And Polymer Thick Film

Small-sized 10-gbit/s Optical Transmitter And Receiver Modules Including 8-bit Mux/demux Ics

A Stud-bump-bonding Technique For High Density Multi-chip-module

On Chip Digital Output Semiconductor Sensor Employing Cmos Inverter Array

Fine Pitch And High Lead Count Multilayer Ceramic Qfp

I/O Pin Solder Point Inspection System

Fine Pitch Tab-lsi Interconnection Technology In MCM

Applications And Technology For Laminate Multicihip Modules

Whisker Reinforced Copper / Glass-ceramic Multilayer Substrate

Proceedings of Japan International Electronic Manufacturing Technology Symposium
Latest Publications