Thermally Conductive Circuit Board Using Anodized Aluminum And Polymer Thick Film

2005 ◽  
Author(s):  
K. Takeda ◽  
Y. Uematsu
Keyword(s):  
Thick Film ◽  
Circuit Board ◽  
Anodized Aluminum ◽  
Thermally Conductive

Degradation Analysis of Thick Film Chip Resistors

2009 ◽  
Author(s):  
Bhanu Sood ◽  
Diganta Das ◽  
Michael H. Azarian ◽  
Michael Pecht
Keyword(s):  
Thick Film ◽  
Printed Circuit Board ◽  
Negative Resistance ◽  
Circuit Board ◽  
High Humidity ◽  
Circuit Boards ◽  
Chemical Modifications ◽  
Current Leakage ◽  
Printed Circuit ◽  
Degradation Analysis

Abstract Negative resistance drift in thick film chip resistors in high temperature and high humidity application conditions was investigated. This paper reports on the investigation of possible causes including formation of current leakage paths on the printed circuit board, delamination between the resistor protective coating and laser trim, and the possibility of silver migration or copper dendrite formation. Analysis was performed on a set of circuit boards exhibiting failures due to this phenomenon. Electrical tests after mechanical and chemical modifications showed that the drift was most likely caused by moisture ingress that created a conductive path across the laser trim.

scholarly journals A User Made Thick Film System

1980 ◽  
Vol 6 (3-4) ◽  
pp. 151-158 ◽  
Author(s):  
M. Honore ◽  
R. Govaearts ◽  
D. Hostens ◽  
B. Bouw ◽  
B. Matton ◽  
...  
Keyword(s):  
Thick Film ◽  
Printed Circuit Board ◽  
State Of The Art ◽  
The State ◽  
Circuit Board ◽  
Film System ◽  
Printed Circuit ◽  
The Subject

This paper describes the state of the art in the development of a polymer based printed circuit board (PCB) compatible resistor ink system. The subject is treated from the standpoint of the manufacturer who, up to now, supplied himself with PCB circuitry.

Chip-On-ACB (Anodized Circuit Board) Package for High Power Light-Emitting Diode

2006 ◽  
Vol 3 (2) ◽  
pp. 67-72
Author(s):  
Kyuho Shin ◽  
Suho Shin ◽  
Soon Cheol Kweon ◽  
Kihwan Kwon ◽  
Seogmoon Choi ◽  
...  
Keyword(s):  
Dielectric Layer ◽  
Heat Dissipation ◽  
Printed Circuit Board ◽  
Light Emitting Diode ◽  
Circuit Board ◽  
Electric Signal ◽  
Anodized Aluminum ◽  
Metal Base ◽  
Light Emitting ◽  
Aluminum Oxide Layer

A new light-emitting diode (LED) package module based on anodized circuit board (ACB) is developed in this study. ACB represents the selectively anodized aluminum board, in which the aluminum oxide layer, formed by anodizing process, serves as a dielectric layer and the electric signal lines are formed on it. LED chips can be directly attached to the metal pads on the aluminum core of ACB, which acts as p-electrode and at the same time easily spreads out the heat generated from the chips. The use of ACB in LED packaging has the benefit that ACB provides an excellent heat dissipation path from junction to board. This characteristic cannot be obtained from metal-core printed circuit board (MC-PCB), because it inevitably has a dielectric layer for electrical insulation of signal lines from metal base, which acts as a blocking layer in the heat path. By using the thermal transient method, the thermal resistance of the LED package (from junction to board) is measured to be about 4 °C/W. Also, we have performed the simulation of heat conduction, of which the results agree well with the experimental results. This chip-on-ACB LED package module has a potential application as a back light unit for display panel.

Embedded Passives: A Novel Approach Using Ceramic Thick Film Technology

2003 ◽  
Author(s):  
Richard C. Snogren
Keyword(s):  
Thick Film ◽  
Printed Circuit Board ◽  
Circuit Board ◽  
Passive Components ◽  
Average Cell ◽  
Novel Approach ◽  
Wide Range ◽  
Embedded Passives ◽  
Improved Performance ◽  
Range Of Values

This paper is an in depth presentation of a novel approach for design and manufacturing processes to embed ceramic thick film resistors and discrete capacitors into circuit board substrates. These robust materials are available in a wide range of values. Embedded passives, i.e., resistors and capacitors built right into the printed circuit board substrate will be the next pivotal technology for the PCB industry, preceded by the plated thru hole in the 50s, and microvias in the 90s. Key drivers are performance, miniaturization, and cost. The average cell phone has 445 SMT passive components at a 25:1 ratio to ICs. Embedding many of these will improve performance, enable more functionality and reduce cost per function. Embedded passives are not limited to cell phones, many other applications will benefit from improved performance. Several materials are commercially available today and many new materials are in development.

The Use of Polymer Thick Film for Making Printed Circuit Boards

1982 ◽  
Vol 1 (1) ◽  
pp. 22-23 ◽  
Author(s):  
F.W. Martin
Keyword(s):  
Thick Film ◽  
Printed Circuit Boards ◽  
Printed Circuit Board ◽  
Electronics Industry ◽  
Circuit Board ◽  
Technical Knowledge ◽  
Circuit Boards ◽  
Printed Circuit ◽  
The Cost

The electronics industry is facing a situation in which the cost of electronic functions is dropping continuously while the cost of interconnecting the functions by traditional means, especially through the use of printed circuit boards, continues to rise. Polymer thick film is one proven approach to reversing the trend of rising interconnection costs. It is relatively easy for the typical printed circuit board manufacturer to convert to or adapt polymer thick film because he has most of the necessary equipment, technical knowledge and personnel.

Thermal effects in embedded thin- and thick-film resistors in comparison to chip resistors

Circuit World ◽  
2014 ◽  
Vol 40 (1) ◽  
pp. 27-32 ◽  
Author(s):  
Wojciech Steplewski ◽  
Andrzej Dziedzic ◽  
Janusz Borecki ◽  
Grazyna Koziol ◽  
Tomasz Serzysko
Keyword(s):  
Energy Dissipation ◽  
Thick Film ◽  
Power Dissipation ◽  
Thermal Effects ◽  
Electrical Current ◽  
Circuit Board ◽  
Heat Radiation ◽  
Content Type ◽  
Different Dimensions ◽  
Embedded Resistors

Purpose – The purpose of this paper is to investigate the thermal behaviour of thin- and thick-film resistor with different dimensions and contacts embedded into printed circuit board (PCB) and compare them to the similar constructions of discrete chip resistors assembled to standard PCBs. Design/methodology/approach – In investigations the thin- and thick-film embedded resistors with the bar form in different dimensions and configurations of contacts as well as rectangular chip resistors in package 0603 and 0402 were used. In tests were carried out the measurements of dissipated power in temperature of resistor about 40°C, 70°C and 155°C. The power dissipation was calculated as a multiplying of electrical current flowing through the resistor with voltage across the resistor. The dissipation of heat generated by electrical current flowing through resistors was examined by means of the FLIR A320 thermographic camera with lens Closeup×2 and the power source. Findings – The results show that, in case of chip resistors, the intensity of heat radiation strongly depends on dimensions of copper contact lands and also depends on the dimensions of the resistor. In case of embedded resistors, with comparable dimensions to chip resistors, they have lower ability to power dissipation, as well as the copper contact lands dimensions have lower influence. The thermal radiation through resin material is not as effective as it is in case of resistors assembled on PCB. However, the embedded thick-film resistors, especially made of paste Minico M2010, have already the similar parameters to 0402 chip resistors. Research limitations/implications – Research shows that embedded resistors can be used interchangeably with SMD resistors it allows to open up space on the surface of PCB, but it should be taken into account the lower energy dissipation capabilities. It is suggested that further studies are necessary for accurately determining the thermal effects and investigate the structures of embedded passive components that allow for better heat management. Originality/value – Thermal stability of embedded resistors during operation is a critical factor of success of embedded resistor technology. The way of power dissipation and heat resistance are one of the important operating parameters of these components. The results provide information about the power and the energy dissipation of embedded thin- and thick-film resistors compared to the standard surface mount technology.

Thermally Conductive Boron Nitride Nanosheet Composite Paper as a Flexible Printed Circuit Board

2018 ◽  
Vol 1 (4) ◽  
pp. 1705-1712 ◽  
Author(s):  
Tun Wang ◽  
Daohui Ou ◽  
Huanhuan Liu ◽  
Shusen Jiang ◽  
Wanying Huang ◽  
...  
Keyword(s):  
Boron Nitride ◽  
Printed Circuit Board ◽  
Circuit Board ◽  
Printed Circuit ◽  
Boron Nitride Nanosheet ◽  
Thermally Conductive ◽  
Flexible Printed Circuit ◽  
Composite Paper

scholarly journals Aerosol Jet Direct Writing Polymer-Thick-Film Resistors for Printed Electronics

2021 ◽  
Vol 34 (1) ◽  
pp. 24-31
Author(s):  
James Feng ◽  
Anthony Loveland ◽  
Michael Renn
Keyword(s):  
Thick Film ◽  
Screen Printing ◽  
Printed Circuit Board ◽  
Printed Electronics ◽  
Electronics Industry ◽  
Circuit Board ◽  
Print Quality ◽  
Direct Write ◽  
Direct Writing ◽  
Fixed Amount

To improve performance and reduce size of printed-circuit board (PCB) in electronics industry, embedding discrete components within a board substrate has been an effective approach by reducing solder joints and their associated impedance mismatching, inductive reactance, etc.  With its unique capabilities for non-contact precision material deposition, the Aerosol Jet® direct-write technology has been enabling additive manufacturing of fine-feature electronics conformally onto flexible substrates of complicated shapes.  The CAD/CAM controlled relative motions between substrate and print head allows convenient adjustment of the pattern and pile height of deposited material at a given ink volumetric deposition rate.  To date in the printed electronics industry, additively printing embedded polymer-thick-film (PTF) resistors has mostly been done with screen printing using carbon-based paste inks.  Here we demonstrate results of Aerosol Jet® printed PTF resistors of resistance values ranging from ~50 W to > 1 kW, adjustable (among several variable parameters) by the number of stacked layers (or print passes with each pass depositing a fixed amount of ink) between contact pads of around 1 mm apart with footprint line typically < 0.3 mm. In principle, any ink material that can be atomized into fine droplets of 1 to 5 microns can be printed with the Aerosol Jet® system.  However, the print quality such as line edge cleanliness can significantly influenced by ink rheology which involves solvent volatility, solids loading, and so on.  Our atomizable carbon ink was made by simply diluting a screen printing paste with a compatible solvent of reasonable volatility, which can be cured at temperatures below 200 oC. We show that Aerosol Jet® printed overlapping lines can be stacked to large pile height (to reduce the resistance value) without significant increase of line width, which enables fabricating embedded resistors with adjustable resistance values in a limited footprint space.

Common Electrical Faults Diagnosis and Elimination of Loom

2014 ◽  
Vol 912-914 ◽  
pp. 956-959
Author(s):  
Zhao Min Lian
Keyword(s):  
Thick Film ◽  
Circuit Board ◽  
Abnormal Sound ◽  
Conduction State ◽  
Faults Diagnosis ◽  
Electrical Faults

This paper discusses the faults of master clutch,broken weft parking,broken weft or warp no-parking,miss operation,inadequate parking and thick-film circuit,and corresponding solutions are put forward:Check clutch and replace the bearings timely when clutch has abnormal sound;Check the brake angle frequently;Pay special attention to the quality of the beam and the original yarn;Enforce vigorously the quality of the main parts; The adjustment of the sensor angle is very important;The most intuitive feel of broken weft or warp no-parking is the faults of sensor;Miss operation of loom dues to the circuit board fault or other faults,regulating improper self-locking,the peripheral circuit,starting circuit fault is in unable to conduction state,or stop circuit fault is in the power state;Inadequate parking shall check the setting position of micro switch.

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