2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems
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82

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6

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Published By IEEE

9781467325387, 9781467325394, 9781467325370

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Challenges in extending single-ended graphics memory data rates

2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems ◽

10.1109/epeps.2012.6457838 ◽

2012 ◽

Author(s):

Sanku Mukherjee ◽

Dan Oh ◽

Arun Vaidyanath ◽

Deborah Dressler ◽

Arul Sendhil

Keyword(s):

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Ultra-high speed memory bus using microwave interconnects

2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems ◽

10.1109/epeps.2012.6457830 ◽

2012 ◽

Author(s):

James T. Aberle ◽

Brahim Bensalem

Keyword(s):

Ultra High Speed

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Loewner-Matrix based efficient algorithm for frequency sweep of high-speed modules

2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems ◽

10.1109/epeps.2012.6457873 ◽

2012 ◽

Author(s):

Muhammad Kabir ◽

Roni Khazaka ◽

Ramachandra Achar ◽

Michel Nakhla

Keyword(s):

Efficient Algorithm ◽

Frequency Sweep

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Fundamental components of the IC packaging electromagnetic interference (EMI) analysis

2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems ◽

10.1109/epeps.2012.6457861 ◽

2012 ◽

Author(s):

Nick K. H. Huang ◽

Li Jun Jiang ◽

Huichun Yu ◽

Gang Li ◽

Shuai Xu ◽

...

Keyword(s):

Electromagnetic Interference ◽

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Millimeter-wave coplanar interconnects and radiators on FR-4 laminates

2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems ◽

10.1109/epeps.2012.6457912 ◽

2012 ◽

Author(s):

Supreetha Rao Aroor ◽

Richard Pierce ◽

Rashaunda Henderson ◽

Andrew Blanchard

Keyword(s):

Millimeter Wave

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A partial homomorphic encryption scheme for secure design automation on public clouds

2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems ◽

10.1109/epeps.2012.6457871 ◽

2012 ◽

Author(s):

Albert Yu ◽

Arun V. Sathanur ◽

Vikram Jandhyala

Keyword(s):

Design Automation ◽

Homomorphic Encryption ◽

Encryption Scheme

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Wafer-level TSV connectivity test using ring oscillator scheme

2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems ◽

10.1109/epeps.2012.6457883 ◽

2012 ◽

Author(s):

Jun So Pak ◽

Jonghyun Cho ◽

Joohee Kim ◽

Heegon Kim ◽

Kiyeong Kim ◽

...

Keyword(s):

Ring Oscillator ◽

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Modeling and measurement of supply noise induced jitter in a 12.8Gbps single-ended memory interface

2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems ◽

10.1109/epeps.2012.6457839 ◽

2012 ◽

Author(s):

Hai Lan ◽

Minghui Han ◽

Ralf Schmitt

Keyword(s):

Supply Noise ◽

Memory Interface

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An unconditionally stable finite-element timedomain layered domain-decomposition algorithm for simulating 3D high-speed circuits

2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems ◽

10.1109/epeps.2012.6457867 ◽

2012 ◽

Author(s):

Xiaolei Li ◽

Jian-Ming Jin

Keyword(s):

Finite Element ◽

Domain Decomposition ◽

Decomposition Algorithm ◽

Unconditionally Stable ◽

Domain Decomposition Algorithm

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Hybrid modeling method for transient simulation of multilayered power/ground planes

2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems ◽

10.1109/epeps.2012.6457898 ◽

2012 ◽

Author(s):

Takayuki Watanabe

Keyword(s):

Modeling Method ◽

Hybrid Modeling ◽

Transient Simulation

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