High Temperature Slow Crack Growth of Sl3N4 Specimens Subjected to Uniaxial and Biaxial Dynamic Fatigue Loading Conditions

Author(s):  
Sung R. Choi ◽  
Noel N. Nemeth ◽  
Jonathan A. Salem ◽  
Lynn M. Powers ◽  
John P. Gyekenyesi
1997 ◽  
Vol 119 (2) ◽  
pp. 273-278 ◽  
Author(s):  
N. R. Osborne ◽  
G. A. Graves ◽  
M. K. Ferber

The purpose of this study was to evaluate the mechanical strength and slow-crack-growth parameter values for two commercially available silicon nitrides, SN-88 and NT164, at three high-temperature conditions. Weibull analysis and dynamic fatigue slow-crack-growth parameters were used to characterize the material strength and resistance to slow crack growth at high temperatures for use in life prediction models. Although both materials are commercially available Si3N4, their high-temperature behavior was found to be significantly different.


Author(s):  
Nora R. Osborne ◽  
George A. Graves ◽  
Matt K. Ferber

The purpose of this study was to evaluate the mechanical strength and slow-crack-growth parameter values for two commercially available silicon nitrides, SN-88 and NT164, at three high temperature conditions. Weibull analysis and dynamic fatigue slow-crack-growth parameters were used to characterize the material strength and resistance to slow crack growth at high temperatures for use in life prediction models. Although both materials are commercially available Si3N4, their high temperature behavior was found to be significantly different.


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