Mineral Filler Flame Retardants

2021 ◽  
pp. 101-168
Author(s):  
Reiner Sauerwein
2021 ◽  
pp. 22-27
Author(s):  
T. V. Zhdanova ◽  
E. M. Chaika ◽  
T. A. Matseevich ◽  
A. A. Askadskii

Measurements of stress relaxation of two samples of decking boards after exposure in rain and chlorinated water, in ice, and in a mixture of gasoline and water in different concentrations from 1 to 7% were carried out. Samples consisting of 60% wood flour, 30% polyvinyl chloride and 10% additives were used for measurements. Additives are flame retardants, stabilizers, modifiers and dyes. The mineral filler CaCO3 was used as modifier. In sample No.1, the CaCO3 content was 42% and the wood content was 18%. For sample No.2, the CaCO3 content was 24% and the wood content was 36%. As a result of measurements after exposure for 200 days, it was found that the relative drop in mechanical stress decreases when the mineral filler is added to the composition. The nonlinear mechanical behavior for the initial sample No.1 is observed at 2% strain, and for the sample No.2 – at 3% strain. When aged in chlorinated water and in ice, the nonlinear mechanical behavior is observed for all deformations. The generalized relaxation curves indicate that decking boards can be used with confidence for a long time.


Author(s):  
Bhanu Sood ◽  
Michael Pecht

Abstract Failures in printed circuit boards account for a significant percentage of field returns in electronic products and systems. Conductive filament formation is an electrochemical process that requires the transport of a metal through or across a nonmetallic medium under the influence of an applied electric field. With the advent of lead-free initiatives, boards are being exposed to higher temperatures during lead-free solder processing. This can weaken the glass-fiber bonding, thus enhancing conductive filament formation. The effect of the inclusion of halogen-free flame retardants on conductive filament formation in printed circuit boards is also not completely understood. Previous studies, along with analysis and examinations conducted on printed circuit boards with failure sites that were due to conductive filament formation, have shown that the conductive path is typically formed along the delaminated fiber glass and epoxy resin interfaces. This paper is a result of a year-long study on the effects of reflow temperatures, halogen-free flame retardants, glass reinforcement weave style, and conductor spacing on times to failure due to conductive filament formation.


2019 ◽  
Vol 775 (10) ◽  
pp. 12-15
Author(s):  
Sh.M. RAKHIMBAEV ◽  
◽  
N.M. TOLYPINA ◽  
A.A. KOSINOVA ◽  
E.N. KHAKHALEVA ◽  
...  

Sign in / Sign up

Export Citation Format

Share Document