Synthesis of bisphenol a novolac epoxy resins for coating applications

2007 ◽  
Vol 107 (1) ◽  
pp. 347-354 ◽  
Author(s):  
Ayman M. Atta ◽  
Nevin O. Shaker ◽  
Notaila E. Nasser

2005 ◽  
Vol 99 (3) ◽  
pp. 858-868 ◽  
Author(s):  
Yanfang Liu ◽  
Chen Zhang ◽  
Zhongjie Du ◽  
Hangquan Li




2007 ◽  
Vol 39 (5) ◽  
pp. 478-487 ◽  
Author(s):  
Guoyuan Pan ◽  
Zhongjie Du ◽  
Chen Zhang ◽  
Congju Li ◽  
Xiaoping Yang ◽  
...  


1993 ◽  
Vol 03 (C4) ◽  
pp. 249-252 ◽  
Author(s):  
T. MIURA ◽  
T. SUZUKI ◽  
Y. OKI ◽  
M. NUMAJIRI ◽  
K. KONDO ◽  
...  


2004 ◽  
Vol 44 (2) ◽  
pp. 376-387 ◽  
Author(s):  
S.-P. Rwei ◽  
A.-Y. Liu ◽  
G.-S. Liou ◽  
K.-C. Cheng ◽  
W. Guo


2008 ◽  
Vol 63 (4) ◽  
pp. 372-376 ◽  
Author(s):  
Ayman M. Atta ◽  
M.I. Abdou ◽  
Abdel-Atif A. Elsayed ◽  
Mohamed E. Ragab


1986 ◽  
Vol 72 ◽  
Author(s):  
Shuichi Kanagawa ◽  
Yutaka Terada

AbstractImpurities, especially chemically bonded impurities, of o-cresol novolac epoxy resins and their influence on the moisture resistance and other properties of the epoxy molding compounds have been investigated to clarify the influence of impurities of epoxy resins on the reliability of encapsulated semiconductor. As a result, the existence of hydrolyzable chlorine and hydroxyl group-containing impurities has been confirmed, and it was found that the impurity such as a hydrolyzable chlorine causes undesirable influence on both the moisture resistance and electrical properties at high temperatures. It was also found that the impurity such as a hydroxyl group causes undesirable influence on the moisture resistance, and that the lower hydroxyl content gives the higher heat resistance as a result of an increase in the epoxy content.



2005 ◽  
Vol 45 (4) ◽  
pp. 478-486 ◽  
Author(s):  
S.P. Rwei ◽  
C.Y. Cheng ◽  
G.S. Liou ◽  
K.C. Cheng


1993 ◽  
Vol 49 (11) ◽  
pp. 1921-1929 ◽  
Author(s):  
T. Suzuki ◽  
Y. Oki ◽  
M. Numajiri ◽  
T. Miura ◽  
K. Kondo ◽  
...  


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