ChemInform Abstract: CHEMICAL ETHCHING OF INDIUM PHOSPHIDE BY HYDROGEN PEROXIDE-SULFURIC ACID-WATER SOLUTION

1980 ◽  
Vol 11 (17) ◽  
Author(s):  
Y. NISHITANI ◽  
T. KOTANI
1999 ◽  
Vol 34 (12) ◽  
pp. 1303-1311 ◽  
Author(s):  
Marina V. Kosevich ◽  
Oleg A. Boryak ◽  
Vlada A. Pashinskaya ◽  
Vadim S. Shelkovsky

JOM ◽  
2020 ◽  
Author(s):  
Joona Rajahalme ◽  
Siiri Perämäki ◽  
Roshan Budhathoki ◽  
Ari Väisänen

AbstractThis study presents an optimized leaching and electrowinning process for the recovery of copper from waste printed circuit boards including studies of chemical consumption and recirculation of leachate. Optimization of leaching was performed using response surface methodology in diluted sulfuric acid and hydrogen peroxide media. Optimum leaching conditions for copper were found by using 3.6 mol L−1 sulfuric acid, 6 vol.% hydrogen peroxide, pulp density of 75 g L−1 with 186 min leaching time at 20°C resulting in complete leaching of copper followed by over 92% recovery and purity of 99.9% in the electrowinning. Study of chemical consumption showed total decomposition of hydrogen peroxide during leaching, while changes in sulfuric acid concentration were minor. During recirculation of the leachate with up to 5 cycles, copper recovery and product purity remained at high levels while acid consumption was reduced by 60%.


2016 ◽  
Vol 121 (4) ◽  
pp. 1736-1751 ◽  
Author(s):  
Joonas Merikanto ◽  
Jonathan Duplissy ◽  
Anni Määttänen ◽  
Henning Henschel ◽  
Neil M. Donahue ◽  
...  

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