A Concurrent Enhancement of Both In‐Plane and Through‐Plane Thermal Conductivity of Injection Molded Polycarbonate/Boron Nitride/Alumina Composites by Constructing a Dense Filler Packing Structure
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Keyword(s):
2021 ◽
Vol 174
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pp. 121306
2021 ◽
Vol 172
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pp. 121145
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2016 ◽
Vol 49
(11)
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pp. 115301
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