Comments on the article “Beneficial effect of Bletilla striata extract solution on zymosan‐induced interstitial cystitis in rat”: Whether the specific part of Bletilla striata which be used for bioactive extraction should be elaborated

Author(s):  
Xiao Zeng ◽  
Hong Shen
2021 ◽  
Vol 40 (3) ◽  
pp. 763-770
Author(s):  
Yi‐Ching Liu ◽  
Wei‐Ting Lee ◽  
Ching‐Chung Liang ◽  
Tsia‐Shu Lo ◽  
Wu‐Chiao Hsieh ◽  
...  

Author(s):  
Yi‐Ching Liu ◽  
Wei‐Ting Lee ◽  
Ching‐Chung Liang ◽  
Tsia‐Shu Lo ◽  
Wu‐Chiao Hsieh ◽  
...  

Author(s):  
Anna C. Fraker

Small amounts of nickel are added to titanium to improve the crevice corrosion resistance but this results in an alloy which has sheet fabrication difficulties and is subject to the formation of large Ti2Ni precipitates. These large precipitates can serve as local corrosion sites; but in a smaller more widely dispersed form, they can have a beneficial effect on crevice corrosion resistance. The purpose of the present work is to show that the addition of a small amount of Mo to the Ti-1.5Ni alloy reduces the Ti2Ni precipitate size and produces a more elongated grained microstructure. It has recently been reported that small additions of Mo to Ti-0.8 to lw/o Ni alloys produce good crevice corrosion resistance and improved fabrication properties.


Author(s):  
Jin Young Kim ◽  
R. E. Hummel ◽  
R. T. DeHoff

Gold thin film metallizations in microelectronic circuits have a distinct advantage over those consisting of aluminum because they are less susceptible to electromigration. When electromigration is no longer the principal failure mechanism, other failure mechanisms caused by d.c. stressing might become important. In gold thin-film metallizations, grain boundary grooving is the principal failure mechanism.Previous studies have shown that grain boundary grooving in gold films can be prevented by an indium underlay between the substrate and gold. The beneficial effect of the In/Au composite film is mainly due to roughening of the surface of the gold films, redistribution of indium on the gold films and formation of In2O3 on the free surface and along the grain boundaries of the gold films during air annealing.


2007 ◽  
Vol 177 (4S) ◽  
pp. 45-45
Author(s):  
J. Quentin Clemens ◽  
Richard T. Meenan ◽  
Maureen C. O’Keeffe Rosetti ◽  
Teresa M. Kimes ◽  
Elizabeth A. Calhoun

2007 ◽  
Vol 177 (4S) ◽  
pp. 44-45
Author(s):  
C. Lowell Parsons ◽  
Mahadevan Rajasekaran ◽  
Marianne Chenoweth ◽  
Paul Stein

2007 ◽  
Vol 177 (4S) ◽  
pp. 44-44
Author(s):  
Robert E. Hurst ◽  
Paul J. Hauser ◽  
Gennady A. Slobodov ◽  
Daniel J. Culkin

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