In-Plane Residual Stress Analysis Combining Hole-Drilling and Moiré Interferometry

2007 ◽  
pp. 907-908
Author(s):  
J. N. Aoh ◽  
C. Y. Huang ◽  
J. Y. Lee
Keyword(s):  
Residual Stress ◽  
Stress Analysis ◽  
Moiré Interferometry ◽  
Hole Drilling ◽  
Moire Interferometry ◽  
Residual Stress Analysis

Study of Surface Residual Stress by Three-Dimensional Displacement Data at a Single Point in Hole Drilling Method

1999 ◽  
Vol 122 (2) ◽  
pp. 215-220 ◽  
Author(s):  
Z. Wu ◽  
J. Lu
Keyword(s):  
Residual Stress ◽  
Single Point ◽  
Accurate Determination ◽  
Three Dimensional ◽  
Moiré Interferometry ◽  
Hole Drilling ◽  
Moire Interferometry ◽  
Blind Hole ◽  
Hole Drilling Method ◽  
Drilling Method

A method combining moire´ interferometry, Twyman–Green interferometry, and blind hole drilling method is proposed for simple and accurate determination of residual stress. The relationship between the three-dimensional surface displacements produced by introducing a blind hole and the corresponding residual stress is established by employing the Fourier expansion solution containing a set of undetermined coefficients. The coefficients are calibrated by 3D finite element method. The surface in-plane displacements Ux,Uy, and the out-of-plane displacement Uz produced by the relaxation of residual stress are measured by moire´ interferometry and Twyman–Green interferometry, respectively, after the hole-drilling procedure. The complete three-dimensional displacement data at any single point around the hole can be used for residual stress determination. The accuracy of the method is analyzed and the experimental procedure is described to determine the sign of residual stresses. As an implementation of the method, a shot peening residual stress problem is studied. [S0094-4289(00)00802-1]

Residual Stress Depth Distributions for Atmospheric Plasma Sprayed MnCo1.9Fe0.1O4 Spinel Layers on Crofer Steel Substrate

2017 ◽  
Vol 905 ◽  
pp. 174-181 ◽  
Author(s):  
Hyoung C. Back ◽  
Markus Mutter ◽  
Jens Gibmeier ◽  
Robert Mücke ◽  
Robert Vaßen
Keyword(s):  
Residual Stress ◽  
Stainless Steel ◽  
Stress Analysis ◽  
Ferritic Stainless Steel ◽  
Steel Substrate ◽  
Atmospheric Plasma ◽  
Cathode Side ◽  
Hole Drilling ◽  
Residual Stress Analysis ◽  
Depth Distributions

In solid oxide fuel cells (SOFC) for operating temperatures of 800 °C or below, the use of ferritic stainless steel can lead to degradation in cell performance due to chromium migration into the cells at the cathode side [1]. Application of a coating on the ferritic stainless steel interconnect is one option to prevent Cr outward migration through the coating. MnCo1.9Fe0.1O4 (in the following designated as MCF) spinels act as a diffusion barrier and retain high conductivity during operation [2]. Knowledge about the residual stress depth distribution throughout the complete APS coating system is important and can help to optimize the coating process. This implicitly requires reliable residual stress analysis in the coating, the interface region and in the substrate.For residual stress analysis on these specific layered systems diffraction based analysis methods (XRD) using laboratory X-ray sources can only by applied at the very surface. For larger depths sublayer removal is necessary to gain reliable residual stress data. The established method for sublayer removal is electrochemical etching, which fails, since the spinel layer is inert. However, a mechanical layer removal will affect the local residual stress distribution.As an alternative, mechanical residual stress analyses techniques can be applied. Recently, we established an approach to analyse residual stress depth distributions in thick film systems by means of the incremental hole drilling method [5, 6]. In this project, we refined our approach for the application on MCF coatings with a layer thickness between 60 – 125 μm.

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