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Multi-TSV (Through Silicon Via) Error Detection Using the Non-contact Probing Method
Applied Computing and Information Technology - Studies in Computational Intelligence
◽
10.1007/978-3-030-25217-5_4
◽
2019
◽
pp. 47-56
Author(s):
Sang-Min Han
◽
Youngkyu Kim
◽
Jin-Ho Ahn
Keyword(s):
Error Detection
◽
Through Silicon Via
Download Full-text
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