Simulation of Intergranular Void Growth Under the Combined Effects of Surface Diffusion, Grain Boundary Diffusion, and Bulk Creep

2021 ◽  
pp. 853-863
Author(s):  
John W. Sanders ◽  
Negar Jamshidi ◽  
Niloofar Jamshidi ◽  
Mohsen Dadfarnia ◽  
Sankara Subramanian ◽  
...  
Keyword(s):  
Grain Boundary ◽  
Surface Diffusion ◽  
Void Growth ◽  
Boundary Diffusion ◽  
Grain Boundary Diffusion ◽  
Combined Effects ◽  
Intergranular Void

Void Growth Behavior in ULSI Cu Interconnections by Grain-Boundary Diffusion Simulation

2010 ◽  
Vol 39 (10) ◽  
pp. 2255-2266
Author(s):  
Takashi Onishi ◽  
Masao Mizuno ◽  
Tetsuya Yoshikawa ◽  
Jun Munemasa ◽  
Takao Inoue ◽  
...  
Keyword(s):  
Grain Boundary ◽  
Void Growth ◽  
Boundary Diffusion ◽  
Growth Behavior ◽  
Grain Boundary Diffusion ◽  
Diffusion Simulation

Effect of Elastic Accommodation on Diffusion-Controlled Cavity Growth in Metals

2000 ◽  
Vol 122 (3) ◽  
pp. 294-299
Author(s):  
R. Mohan ◽  
J. Zhang ◽  
F. W. Brust
Keyword(s):  
Grain Boundary ◽  
Growth Rates ◽  
Void Growth ◽  
Boundary Diffusion ◽  
Virtual Work ◽  
Cell Model ◽  
Cavity Growth ◽  
Grain Boundary Diffusion ◽  
Transient Time ◽  
Diffusion Controlled

The effect of elastic accommodation on the grain boundary diffusion-controlled void growth was analyzed using an axisymmetric unit cell model. An incremental form of the virtual work principle was used to formulate the boundary value problem involving grain boundary diffusion. The model accounts for material elasticity and void interaction effects. Analyses are performed for initially spherical voids spaced periodically along the grain boundary. The results of the analyses on void growth rates agree well with the Hull-Rimmer model after the initial transient time. During the elastic transient, void growth rates can be several orders of magnitude higher than the steady state growth rate. Though the elastic transient time may occupy a small portion of the total rupture time, in metallic components experiencing cyclic loading conditions with short hold times, elasticity effects may be important. [S0094-4289(00)00903-8]

The Effect of a Passivation Over-Layer on Tile Mechanisms of Stress Relaxation in Continuous Films and Narrow Lines of Aluminum

1991 ◽  
Vol 225 ◽  
Author(s):  
C. A. Paszkiet ◽  
M. A. Korhonen ◽  
Che-Yu Li
Keyword(s):  
Stress Relaxation ◽  
Grain Boundary ◽  
Void Growth ◽  
Boundary Diffusion ◽  
Grain Boundary Diffusion ◽  
Diffusion Controlled

ABSTRACTStress relaxation was studied in bare and nitride-covered continuous films and narrow lines of aluminum. The rate of relaxation in unpassivated metallizations is shown to be consistent with a dislocation-controlled mechanism. Relaxation in passivated lines appears to depend on grain boundary diffusion-controlled void growth. In passivated continuous films, two rate-controlling mechanisms appear to operate in sequence.

scholarly journals Thermo-electro-mechanical modeling of spark plasma sintering processes accounting for grain boundary diffusion and surface diffusion

2021 ◽  
Vol 67 (5) ◽  
pp. 1395-1407
Author(s):  
A. S. Semenov ◽  
J. Trapp ◽  
M. Nöthe ◽  
O. Eberhardt ◽  
B. Kieback ◽  
...  
Keyword(s):  
Grain Boundary ◽  
Surface Diffusion ◽  
Spark Plasma Sintering ◽  
Boundary Diffusion ◽  
Grain Boundary Diffusion ◽  
Experimental Results ◽  
Interparticle Contact ◽  
Mechanical Problem ◽  
Plasma Sintering ◽  
Spark Plasma

AbstractIn the present research, a numerical modeling approach of the initial stage of consolidation during spark plasma sintering on the microscopic scale is presented. The solution of a fully coupled thermo-electro-mechanical problem also accounting for grain boundary and surface diffusion is found by using a staggered way. The finite-element method is applied for solving the thermo-electro-mechanical problem while the finite-difference method is applied for the diffusion problem. A Lagrange-based non-linear formulation is used to deal with the detailed description of plastic and creep strain accumulation. The numerical model is developed for simulating the structural evolution of the involved particles during sintering of powder compacts taking into account both the free surface diffusion of the particles and the grain boundary diffusion at interparticle contact areas. The numerical results obtained by using the two-particle model—as a representative volume element of the powder—are compared with experimental results for the densification of a copper powder compact. The numerical and experimental results are in excellent agreement.

Void growth due to creep and grain boundary diffusion at high triaxialities

1995 ◽  
Vol 43 (1) ◽  
pp. 123-165 ◽  
Author(s):  
E. Van Der Giessen ◽  
M.W.D. Van Der Burg ◽  
A. Needleman ◽  
V. Tvergaard
Keyword(s):  
Grain Boundary ◽  
Void Growth ◽  
Boundary Diffusion ◽  
Grain Boundary Diffusion

The Effect of A Passivation Over-Layer on the Mechanisms of Stress Relaxation in Continuous Films and Narrow Lines of Aluminum

1991 ◽  
Vol 226 ◽  
Author(s):  
C. A. Paszkiet ◽  
M. A. Korhonen ◽  
Che-Yu Li
Keyword(s):  
Stress Relaxation ◽  
Grain Boundary ◽  
Void Growth ◽  
Boundary Diffusion ◽  
Grain Boundary Diffusion ◽  
Diffusion Controlled

AbstractStress relaxation was studied in bare and nitride-covered continuous films and narrow lines of aluminum. The rate of relaxation in unpassivated metallizations is shown to be consistent with a dislocation-controlled mechanism. Relaxation in passivated lines appears to depend on grain boundary diffusion-controlled void growth. In passivated continuous films, two rate-controlling mechanisms appear to operate in sequence.

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