Real-Time Inspection System for Printed Circuit Boards

2003 ◽  
pp. 458-465 ◽  
Author(s):  
Kang-Sun Choi ◽  
Jae-Young Pyun ◽  
Nam-Hyeong Kim ◽  
Byeong-Doo Choi ◽  
Sung-Jea Ko
Keyword(s):  
Real Time ◽  
Printed Circuit Boards ◽  
Inspection System ◽  
Circuit Boards ◽  
Printed Circuit

scholarly journals A FPGA implementation of solder paste deposit on printed circuit boards error detector based in a bright and contrast algorithm

2007 ◽  
Vol 5 (02) ◽  
Author(s):  
A. De Luca-Pennacchia ◽  
M. Á. Sánchez-Martí­nez
Keyword(s):  
Printed Circuit Boards ◽  
Computational Time ◽  
Inspection System ◽  
Solder Paste ◽  
Circuit Boards ◽  
Printed Circuit ◽  
Optical Inspection ◽  
Error Detector ◽  
Time Requirements ◽  
Computational Time Cost

Solder paste deposit on printed circuit boards (PCB) is a critical stage. It is known that about 60% of functionality defects in this type of boards are due to poor solder paste printing. These defects can be diminished by means of automatic optical inspection of this printing. Actually, this process is implemented by image processing software with its inherent high computational time cost. In this paper we propose to implement a high parallel degree image comparison algorithm suitable to be implemented on FPGA, which could be incorporated to an automatic inspection system. The hardware implementation of the algorithm allows us to fulfill time requirements demanded by industry.

Automated Visual Inspection System for Printed Circuit Boards for Small Series Production

2017 ◽  
pp. 79-107
Author(s):  
Alexandre Reeberg de Mello ◽  
Marcelo Ricardo Stemmer
Keyword(s):  
Printed Circuit Boards ◽  
Production Quality ◽  
Inspection System ◽  
Series Production ◽  
Circuit Boards ◽  
Printed Circuit ◽  
Industrial Community ◽  
Small Series ◽  
Processing Techniques ◽  
Inspection Machine

There is a crescent need to produce Printed Circuit Boards (PCB) in a customized and efficient way, therefore, there is an effort from the scientific and industrial community to improve image processing techniques for PCB inspection. The methods proposed at this chapter aim the formation of a system to inspect SMD (Surface Mounted Devices) components in a SSP (Small Series Production), ensuring a satisfactory production quality. This way, a 3-step inspection system is proposed, formed by image preprocessing, feature extraction and evaluation components, based on characteristics related to shape, positioning and histogram of the component. The inspection machine used in this project is inserted in a cooperation among machines context, in order to provide a fully autonomous factory, coordinated by a multi-agent system. Experimental obtained results show that the proposed inspection system is suitable for the case, reaching a success rate above 89% when using actual components.

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