scholarly journals A FPGA implementation of solder paste deposit on printed circuit boards error detector based in a bright and contrast algorithm

Author(s):  
A. De Luca-Pennacchia ◽  
M. Á. Sánchez-Martí­nez

Solder paste deposit on printed circuit boards (PCB) is a critical stage. It is known that about 60% of functionality defects in this type of boards are due to poor solder paste printing. These defects can be diminished by means of automatic optical inspection of this printing. Actually, this process is implemented by image processing software with its inherent high computational time cost. In this paper we propose to implement a high parallel degree image comparison algorithm suitable to be implemented on FPGA, which could be incorporated to an automatic inspection system. The hardware implementation of the algorithm allows us to fulfill time requirements demanded by industry.




2013 ◽  
Vol 325-326 ◽  
pp. 1614-1618
Author(s):  
Guang Jie Xiong ◽  
Yu Fei Liu ◽  
Rui Zhen Liu

Captured circular marks are deformed sometimes when Automatic Optical Inspection (AOI) is used to detect various defects on Printed Circuit Boards (PCB), which may affect the precision of inspection. A new accurate positioning method of circular marks is proposed to solve the problem by obtaining the center of the most round ellipse based on the criterion that the ratio of the difference between the length and width of its circumscribed rectangle and the width of the rectangle is less than 0.1. The simulation tests show that, if the mark has much more deformations, the center positioning error of the proposed algorithm is about 0.013 pixels, and the running time is less than 40ms. Therefore, the proposed method provides good characteristics such as speediness, strong anti-interference ability and robustness.



2013 ◽  
Vol 60 (6) ◽  
pp. 2318-2331 ◽  
Author(s):  
Csaba Benedek ◽  
Olivér Krammer ◽  
Mihály Janoczki ◽  
László Jakab


2019 ◽  
Vol 1 (7) ◽  
pp. 35-41
Author(s):  
G. I. Korshunov ◽  
A. A. Petrushevskaya ◽  
P. S. Zaitsev

The article discusses the application principles of the industry 4.0 concept to improve the basic technological processes of electronics production. The problems of quality assurance in the automatic installation of printed circuit boards. Examples of the introduction optical inspections and fluoroscopy to reduce the marriage are given. The features of screen printing processes and their control using 2D and 3D inspections are considered. The location structure of the automatic optical inspection installations in the automatic line of printed wiring and communication of the automatic screen printing printer and 3D solder paste inspection is presented. A process model for the automatic installation of printed circuit boards using the elements of Industry 4.0 is presented. The organization of machine-to-machine interaction increases the automation of the system and eliminates the «human factor», as a result of which the production process is accelerated and the probability of occurrence erroneous actions resulting in nonconformities of products with standards is reduced. The tasks of organizing and certification of 3D fluoroscopy electronics, as well as the actual improving tasks the typical automatic assembly line of printed circuit boards, are considered.



Author(s):  
Kang-Sun Choi ◽  
Jae-Young Pyun ◽  
Nam-Hyeong Kim ◽  
Byeong-Doo Choi ◽  
Sung-Jea Ko








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