Automated optical inspection system for professional double face printed circuit boards

Author(s):  
C. de Almeida Barreto ◽  
J.A. Zuffo ◽  
S.T. Kofuji
Author(s):  
A. De Luca-Pennacchia ◽  
M. Á. Sánchez-Martí­nez

Solder paste deposit on printed circuit boards (PCB) is a critical stage. It is known that about 60% of functionality defects in this type of boards are due to poor solder paste printing. These defects can be diminished by means of automatic optical inspection of this printing. Actually, this process is implemented by image processing software with its inherent high computational time cost. In this paper we propose to implement a high parallel degree image comparison algorithm suitable to be implemented on FPGA, which could be incorporated to an automatic inspection system. The hardware implementation of the algorithm allows us to fulfill time requirements demanded by industry.


2013 ◽  
Vol 325-326 ◽  
pp. 1614-1618
Author(s):  
Guang Jie Xiong ◽  
Yu Fei Liu ◽  
Rui Zhen Liu

Captured circular marks are deformed sometimes when Automatic Optical Inspection (AOI) is used to detect various defects on Printed Circuit Boards (PCB), which may affect the precision of inspection. A new accurate positioning method of circular marks is proposed to solve the problem by obtaining the center of the most round ellipse based on the criterion that the ratio of the difference between the length and width of its circumscribed rectangle and the width of the rectangle is less than 0.1. The simulation tests show that, if the mark has much more deformations, the center positioning error of the proposed algorithm is about 0.013 pixels, and the running time is less than 40ms. Therefore, the proposed method provides good characteristics such as speediness, strong anti-interference ability and robustness.


Author(s):  
Kang-Sun Choi ◽  
Jae-Young Pyun ◽  
Nam-Hyeong Kim ◽  
Byeong-Doo Choi ◽  
Sung-Jea Ko

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