On the Multiple Fault Attacks on RSA Signatures with LSBs of Messages Unknown

Author(s):  
Lidong Han ◽  
Wei Wei ◽  
Mingjie Liu
Sensors ◽  
2020 ◽  
Vol 20 (7) ◽  
pp. 1976 ◽  
Author(s):  
Liang Dong ◽  
Hongxin Zhang ◽  
Shaofei Sun ◽  
Lei Zhu ◽  
Xiaotong Cui ◽  
...  

Embedded encryption devices and smart sensors are vulnerable to physical attacks. Due to the continuous shrinking of chip size, laser injection, particle radiation and electromagnetic transient injection are possible methods that introduce transient multiple faults. In the fault analysis stage, the adversary is unclear about the actual number of faults injected. Typically, the single-nibble fault analysis encounters difficulties. Therefore, in this paper, we propose novel ciphertext-only impossible differentials that can analyze the number of random faults to six nibbles. We use the impossible differentials to exclude the secret key that definitely does not exist, and then gradually obtain the unique secret key through inverse difference equations. Using software simulation, we conducted 32,000 random multiple fault attacks on Midori. The experiments were carried out to verify the theoretical model of multiple fault attacks. We obtain the relationship between fault injection and information content. To reduce the number of fault attacks, we further optimized the fault attack method. The secret key can be obtained at least 11 times. The proposed ciphertext-only impossible differential analysis provides an effective method for random multiple faults analysis, which would be helpful for improving the security of block ciphers.


Author(s):  
Jean-Sébastien Coron ◽  
Antoine Joux ◽  
Ilya Kizhvatov ◽  
David Naccache ◽  
Pascal Paillier
Keyword(s):  

Author(s):  
J. Gaudestad ◽  
F. Rusli ◽  
A. Orozco ◽  
M.C. Pun

Abstract A Flip Chip sample failed short between power and ground. The reference unit had 418Ω and the failed unit with the short had 16.4Ω. Multiple fault isolation techniques were used in an attempt to find the failure with thermal imaging and Magnetic Current Imaging being the only techniques capable of localizing the defect. To physically verify the defect location, the die was detached from the substrate and a die cracked was seen using a visible optical microscope.


2012 ◽  
Vol 14 ◽  
pp. 223-228 ◽  
Author(s):  
E. Vidyasagar ◽  
P.V.N. Prasad ◽  
Ather Fatima

2002 ◽  
Vol 12 (8) ◽  
pp. 675-696 ◽  
Author(s):  
Robert H. Chen ◽  
Jason L. Speyer

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