Determination of the Transient Thermal Behaviour of Thyristors with Cooling Devices

1991 ◽  
pp. 57-57
Author(s):  
Herbert Niessner
Keyword(s):  
Thermal Behaviour ◽  
Cooling Devices ◽  
Transient Thermal

scholarly journals Thermal impedance at the interface of contacting bodies: 1-D examples solved by semi-derivatives

2012 ◽  
Vol 16 (2) ◽  
pp. 623-627 ◽  
Author(s):  
Jordan Hristov
Keyword(s):  
Heat Conduction ◽  
Fractional Calculus ◽  
Half Time ◽  
Thermal Impedance ◽  
Entire Domain ◽  
Transient Thermal ◽  
Two Bodies

Simple 1-D semi-infinite heat conduction problems enable to demonstrate the potential of the fractional calculus in determination of transient thermal impedances of two bodies with different initial temperatures contacting at the interface ( x = 0 ) at t = 0 . The approach is purely analytic and uses only semi-derivatives (half-time) and semi-integrals in the Riemann-Liouville sense. The example solved clearly reveals that the fractional calculus is more effective in calculation the thermal resistances than the entire domain solutions.

scholarly journals Thermal impedance estimations by semi-derivatives and semi-integrals: 1-D semi-infinite cases

2013 ◽  
Vol 17 (2) ◽  
pp. 581-589 ◽  
Author(s):  
Jordan Hristov ◽  
Ganaoui El
Keyword(s):  
Heat Conduction ◽  
Fractional Calculus ◽  
Boundary Conditions ◽  
Half Time ◽  
Thermal Impedance ◽  
Entire Domain ◽  
Various Boundary Conditions ◽  
Transient Thermal

Simple 1-D semi-infinite heat conduction problems enable to demonstrate the potential of the fractional calculus in determination of transient thermal impedances under various boundary conditions imposed at the interface (x=0). The approach is purely analytic and very effective because it uses only simple semi-derivatives (half-time) and semi-integrals and avoids development of entire domain solutions. 0x=

A Simplified Transient Thermal Analysis of Resistance Spot Welding Process

2010 ◽  
Vol 154-155 ◽  
pp. 443-446
Author(s):  
Zhi Gang Hou ◽  
Jun Zhao ◽  
Li Qiang Xu ◽  
Zhong Guo
Keyword(s):  
Resistance Spot Welding ◽  
Spot Welding ◽  
Complex Structure ◽  
Welding Process ◽  
Temperature Dependent ◽  
Resistance Spot ◽  
Whole Process ◽  
History Of ◽  
Transient Thermal

In order to theoretically simulate the welding process of complex structure with large quantities of welding spots, a simplified method for analyzing a single spot welding should be developed firstly. In this paper, a 2D axisymmetric model of thermoelectric Finite Element Method (FEM) is developed to analyze the transient thermal behavior of Resistance Spot Welding (RSW) process using ANSYS. The determination of the contact resistance at the faying surface is moderately simplified to reduce the calculating time, while the temperature dependent material properties, phase change and convectional boundary conditions are taken into account for the improvement of the calculated accuracy. The thermal history of the whole process and temperature distributions for any position in the weldment is obtained through the analysis. The model can also predict the weld nugget size and the width of the Heat Affected Zone (HAZ).

Thermal Investigations on CMOS Integrated Micro-Hot-Plates Using IR Thermography

2012 ◽  
Author(s):  
Christian Schmidt ◽  
Frank Altmann ◽  
Giorgio C. Mutinati ◽  
Elise Brunet ◽  
Stephan Steinhauer ◽  
...  
Keyword(s):  
Thermal Behaviour ◽  
Absolute Temperature ◽  
Temperature Measurements ◽  
Coating Process ◽  
Ir Thermography ◽  
Black Paint ◽  
Paint Coating ◽  
Thermal Investigations

Abstract In this paper, investigations on absolute temperature measurements using IR-Thermography of CMOS integrated micro-hot-plates (μHP) are presented. The results of using two different approaches, emissivity correction and black paint coating, are presented and compared with respect to simulation and electrical testing results. In addition, FIB/SEM investigations were used for surface investigations and determination of possible influences to the thermal behaviour by black paint coating process.

Transient thermal behaviour of ground electrodes Part II: Cylindrical electrodes

1968 ◽  
Vol 2 (4) ◽  
pp. 373-379
Author(s):  
G. J. Berg ◽  
A. G. Herron
Keyword(s):  
Thermal Behaviour ◽  
Transient Thermal
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