Molecular Dynamics (MD) are now having orthodox means for simulation of matter in
nano-scale. It can be regarded as an accurate alternative for experimental work in nano-science. In
this paper, Molecular Dynamics simulation of uniaxial tension of some face centered cubic (FCC)
metals (namely Au, Ag, Cu and Ni) at nano-level have been carried out. Sutton-Chen potential
functions and velocity Verlet formulation of Noise-Hoover dynamic as well as periodic boundary
conditions were applied. MD simulations at different loading rates and temperatures were
conducted, and it was concluded that by increasing the temperature, maximum engineering stress
decreases while engineering strain at failure is increasing. On the other hand, by increasing the
loading rate both maximum engineering stress and strain at failure are increasing.
Shuffling mode competition leads to directionally anisotropic mobility of faceted Σ11 boundaries in fcc metals
