Diffusional relaxation in ZnS after thermal doping at 800°C

2010 ◽  
Vol 77 (1) ◽  
pp. 95-103 ◽  
Author(s):  
Yu. Yu. Bacherikov ◽  
S. V. Optasyuk
Keyword(s):  
Diffusional Relaxation

Diffusional relaxation around a second phase particle

1980 ◽  
Vol 28 (3) ◽  
pp. 319-325 ◽  
Author(s):  
T. Mori ◽  
M. Okabe ◽  
T. Mura
Keyword(s):  
Phase Particle ◽  
Second Phase ◽  
Diffusional Relaxation

Diffusional Relaxation Effects in Hydrogen Charged Silicon Iron

1968 ◽  
Vol 27 (1) ◽  
pp. K37-K39
Author(s):  
J. Kinel ◽  
L. Kozłsowski ◽  
J. W. Morońa
Keyword(s):  
Silicon Iron ◽  
Relaxation Effects ◽  
Diffusional Relaxation

Mechanical Properties and Microstructure of AL(1wt%SI) And AL(1wt%SI, 0.5wt%CU) Thin Films. The Role of Diffusional Creep in the Tensile Stress Regime

1994 ◽  
Vol 356 ◽  
Author(s):  
S. Bader ◽  
E. M. Kalaugher ◽  
E. Arzt
Keyword(s):  
Mechanical Properties ◽  
Relaxation Mechanism ◽  
Diffusional Creep ◽  
Stress Regime ◽  
Cu Films ◽  
Dislocation Glide ◽  
Transmission Electron ◽  
Diffusional Relaxation ◽  
Coble Creep

AbstractThe microstructure and mechanical properties of hot (h) and cold (c) sputtered Al-lwt%Si and Al-lwt%Si-0.5wt%Cu films were studied using transmission electron microscopy and wafer curvature stress measurements.Stress/temperature curves of all films showed only slight differences in compression on healing once a stable grain size was established. However, on cooling several remarkable differences were observed. These observations cannot be explained by assuming dislocation glide/climb as the dominant relaxation mechanism. The results will be discussed in terms of grain boundary diffusional relaxation (Coble creep), which occurs in addition to dislocation glide.

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