Improving Anti-Reflection MgF2 Thin Films by Laser Shock Peening and Investigation of its Laser Damage Threshold

2015 ◽  
Vol 82 (1) ◽  
pp. 58-62 ◽  
Author(s):  
M. H. Maleki ◽  
H. R. Dizaji ◽  
A. Ghorbani
2014 ◽  
Vol 53 (5) ◽  
pp. 850 ◽  
Author(s):  
Shuvendu Jena ◽  
Raj Bahadur Tokas ◽  
Nitin M. Kamble ◽  
Sudhakar Thakur ◽  
Naba Kishore Sahoo

2004 ◽  
Vol 126 (1) ◽  
pp. 10-17 ◽  
Author(s):  
Wenwu Zhang ◽  
Y. Lawrence Yao ◽  
I. C. Noyan

Microscale Laser Shock Peening (LSP), also known as Laser Shock Processing, is a technique that can be potentially applied to manipulate residual stress distributions in metal film structures and thus improve the fatigue performances of micro-devices made of such films. In this study, microscale LSP of copper films on single crystal silicon substrate is investigated. Before and after-process curvature measurement verifies that sizable compressive residual stress can be induced in copper thin films using microscale LSP. Improved modeling work of shock pressure is summarized and the computed shock pressure is used as loading in 3D stress/strain analysis of the layered film structure. Simulation shows that the stress/strain distribution in the metal film is close to equi-biaxial and is coupled into the silicon substrate.


2004 ◽  
Vol 126 (1) ◽  
pp. 18-24 ◽  
Author(s):  
Wenwu Zhang ◽  
Y. Lawrence Yao ◽  
I. C. Noyan

Microscale Laser Shock Peening (LSP) is a technique that can be potentially applied to manipulate the residual stress distributions in metal film structures and thus improve the reliability of micro-devices. This paper reports high-spatial-resolution characterization of shock treated copper thin films on single-crystal silicon substrates, where scanning x-ray microtopography is used to map the relative variation of the stress/strain field with micron spatial resolution, and instrumented nanoindentation is applied to measure the distribution of hardness and deduce the sign of the stress/strain field. The measurement results are also compared with 3-D simulation results. The general trends in simulations agree with those from experimental measurements. Simulations and experiments show that there is a near linear correlation between strain energy density at the film-substrate interface and the X-ray diffraction intensity contrast.


2001 ◽  
Author(s):  
Jerzy Ciosek ◽  
Wojciech Paszkowicz ◽  
Piotr Pankowski ◽  
Jerzy B. Pelka ◽  
Lech T. Baczewski ◽  
...  

2019 ◽  
Vol 112 ◽  
pp. 245-254
Author(s):  
S. Maidul Haque ◽  
Rajnarayan De ◽  
S. Tripathi ◽  
C. Mukherjee ◽  
S.N. Jha ◽  
...  

1995 ◽  
Vol 14 (1) ◽  
pp. 74-76
Author(s):  
N. Balasundaram ◽  
D. Mangalaraj ◽  
Sa. K. Narayandass ◽  
C. Balasubramanian

2007 ◽  
Vol 102 (6) ◽  
pp. 063105 ◽  
Author(s):  
Jianke Yao ◽  
Zhengxiu Fan ◽  
Yunxia Jin ◽  
Yuanan Zhao ◽  
Hongbo He ◽  
...  

Author(s):  
Youneng Wang ◽  
Hongqiang Chen ◽  
Jeffrey W. Kysar ◽  
Y. Lawrence Yao

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