Interfacial microstructure evolution of solder joints by doping Cu nanoparticles into Ni(P) electroless plating

2020 ◽  
Vol 31 (22) ◽  
pp. 20232-20244
Author(s):  
Jinxuan Cheng ◽  
Jiankang Zhang ◽  
Yi Liu ◽  
Xiaowu Hu ◽  
Zhe Zhang ◽  
...  
Keyword(s):  
Microstructure Evolution ◽  
Electroless Plating ◽  
Solder Joints ◽  
Interfacial Microstructure ◽  
Cu Nanoparticles

Effects of isothermal aging on interfacial microstructure evolution and shear behavior of Au-12Ge/Ni(P)/Kovar Solder Joints

2020 ◽  
Vol 124 ◽  
pp. 106865
Author(s):  
Yufeng Huang ◽  
Xun Chen ◽  
Feng Xue ◽  
Tong Wu ◽  
Wensheng Liu ◽  
...  
Keyword(s):  
Microstructure Evolution ◽  
Isothermal Aging ◽  
Solder Joints ◽  
Shear Behavior ◽  
Interfacial Microstructure

Interfacial microstructure evolution and properties of Sn-0.3Ag-0.7Cu–xSiC solder joints

2021 ◽  
pp. 140995
Author(s):  
Limeng Yin ◽  
Zhongwen Zhang ◽  
Zilong Su ◽  
Hehe Zhang ◽  
Cunguo Zuo ◽  
...  
Keyword(s):  
Microstructure Evolution ◽  
Solder Joints ◽  
Interfacial Microstructure

Interfacial Microstructure Evolution of Copper/Aluminium Laminates with Different Annealing Processes

2011 ◽  
Vol 239-242 ◽  
pp. 2976-2980 ◽  
Author(s):  
Ying Hui Zhang ◽  
Jing Qin ◽  
Hong Jin Zhao ◽  
Gao Lei Xu
Keyword(s):  
Intermetallic Compounds ◽  
Incubation Period ◽  
Microstructure Evolution ◽  
Diffusion Zone ◽  
Interfacial Microstructure ◽  
Combination Process ◽  
Local Areas

The interfacial microstructure evolution of copper/aluminium laminates with different annealing processes was studied. It was found that the formation and growth of intermetallic compounds in the interface during metallurgical combination process have four stages: the incubation period, the formation of island-like new phases in local areas, the transverse-lengthwise-transverse growth of diffusion zone, the formation of new intermetallic compounds and thickening of diffusion zone.

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