2020 IEEE 70th Electronic Components and Technology Conference (ECTC)
Latest Publications

TOTAL DOCUMENTS

360

(FIVE YEARS 360)

H-INDEX

2

(FIVE YEARS 2)

Published By IEEE

9781728161808

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

ECTC 2020 Commentary

2020 IEEE 70th Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc32862.2020.00001 ◽

2020 ◽

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A study on laser-assisted bonding (LAB) and its influence on luminescence characteristics of blue and YAG phosphor encapsulated InGaN LEDs

2020 IEEE 70th Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc32862.2020.00301 ◽

2020 ◽

Author(s):

Matthias Fettke ◽

Andrej Kolbasow ◽

Vinith Bejugam ◽

Timo Kubsch ◽

Alexander Frick ◽

...

Keyword(s):

Luminescence Characteristics

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Advances in High Performance RDL Technologies for Enabling IO Density of 500 IOs/mm/layer and 8-μm IO Pitch Using Low-k Dielectrics

2020 IEEE 70th Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc32862.2020.00182 ◽

2020 ◽

Author(s):

Fuhan Liu ◽

Rui Zhang ◽

Bartlet H. DeProspo ◽

Shreya Dwarakanath ◽

Pratik Nimbalkar ◽

...

Keyword(s):

High Performance ◽

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Graphene-Based Sensing Skins Manufactured by Scalable and Controllable Assembly

2020 IEEE 70th Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc32862.2020.00113 ◽

2020 ◽

Author(s):

Long Wang ◽

Rui Kou ◽

Ying Zhong

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3D FOWLP Integration

2020 IEEE 70th Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc32862.2020.00270 ◽

2020 ◽

Author(s):

Lim Teck Guan ◽

David Soon Wee Ho ◽

Chai Tai Chong ◽

Surya Bhattacharya

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Reliability of homogeneous Sn-Bi and hybrid Sn-Bi/SAC BGAs

2020 IEEE 70th Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc32862.2020.00236 ◽

2020 ◽

Author(s):

Chongyang Cai ◽

Jiefeng Xu ◽

Huayan Wang ◽

Seungbae Park

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Direct Bonding of GaN to Diamond Substrate at Room Temperature

2020 IEEE 70th Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc32862.2020.00210 ◽

2020 ◽

Author(s):

Tadatomo Suga ◽

Fengwen Mu

Keyword(s):

Room Temperature ◽

Diamond Substrate

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Effects of Process Parameters and Isothermal Fatigue Cycling on Electromechanical Properties of Screen-printed Interconnect on Nonwovens for Wearable Electronics

2020 IEEE 70th Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc32862.2020.00337 ◽

2020 ◽

Author(s):

B. Garakani ◽

K. U. S. Somarathna ◽

G.S. Khinda ◽

E. Enakerakpo ◽

M. Alhendi ◽

...

Keyword(s):

Process Parameters ◽

Wearable Electronics ◽

Electromechanical Properties ◽

Fatigue Cycling ◽

Isothermal Fatigue ◽

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Imaging sub-surface defects in power electronic modules using shear-force microscopy

2020 IEEE 70th Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc32862.2020.00221 ◽

2020 ◽

Author(s):

Vijay Venkatesh ◽

Shailesh N. Joshi ◽

Vishnu Baba Sundaresan

Keyword(s):

Shear Force ◽

Surface Defects ◽

Power Electronic ◽

Force Microscopy ◽

Shear Force Microscopy

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Identification of polymer materials in electronic packages including counterfeit prevention

2020 IEEE 70th Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc32862.2020.00361 ◽

2020 ◽

Author(s):

Junbo Yang ◽

Jiefeng Xu ◽

Seungbae Park

Keyword(s):

Polymer Materials ◽

Electronic Packages

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