Interfacial microstructure evolution and shear behavior of Au–20Sn/(Sn)Cu solder joints bonded at 250 °C

2016 ◽  
Vol 651 ◽  
pp. 626-635 ◽  
Author(s):  
Wensheng Liu ◽  
Yikai Wang ◽  
Yunzhu Ma ◽  
Qiang Yu ◽  
Yufeng Huang
2020 ◽  
Vol 124 ◽  
pp. 106865
Author(s):  
Yufeng Huang ◽  
Xun Chen ◽  
Feng Xue ◽  
Tong Wu ◽  
Wensheng Liu ◽  
...  

Author(s):  
Limeng Yin ◽  
Zhongwen Zhang ◽  
Zilong Su ◽  
Hehe Zhang ◽  
Cunguo Zuo ◽  
...  

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