Interfacial microstructure evolution and shear behavior of Au–20Sn/(Sn)Cu solder joints bonded at 250 °C
2016 ◽
Vol 651
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pp. 626-635
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2016 ◽
Vol 28
(4)
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pp. 3685-3694
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2019 ◽
Vol 30
(24)
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pp. 21126-21137
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2020 ◽
Vol 31
(6)
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pp. 4905-4914
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2019 ◽
Vol 799
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pp. 124-136
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2016 ◽
Vol 46
(4)
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pp. 2021-2029
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2020 ◽
Vol 31
(22)
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pp. 20232-20244