Interfacial microstructure evolution and shear strength of Sn0.7Cu–xNi/Cu solder joints

2018 ◽  
Vol 29 (13) ◽  
pp. 11314-11324 ◽  
Author(s):  
Yanqing Lai ◽  
Xiaowu Hu ◽  
Yulong Li ◽  
Xiongxin Jiang
Keyword(s):  
Shear Strength ◽  
Microstructure Evolution ◽  
Solder Joints ◽  
Interfacial Microstructure

Effects of isothermal aging on interfacial microstructure evolution and shear behavior of Au-12Ge/Ni(P)/Kovar Solder Joints

2020 ◽  
Vol 124 ◽  
pp. 106865
Author(s):  
Yufeng Huang ◽  
Xun Chen ◽  
Feng Xue ◽  
Tong Wu ◽  
Wensheng Liu ◽  
...  
Keyword(s):  
Microstructure Evolution ◽  
Isothermal Aging ◽  
Solder Joints ◽  
Shear Behavior ◽  
Interfacial Microstructure

Interfacial microstructure evolution and properties of Sn-0.3Ag-0.7Cu–xSiC solder joints

2021 ◽  
pp. 140995
Author(s):  
Limeng Yin ◽  
Zhongwen Zhang ◽  
Zilong Su ◽  
Hehe Zhang ◽  
Cunguo Zuo ◽  
...  
Keyword(s):  
Microstructure Evolution ◽  
Solder Joints ◽  
Interfacial Microstructure

Microstructure Evolution of Sn-2.5Ag-2.0Ni Solder Joint with Various Ni Platings on SiCp/Al Composites

2010 ◽  
Vol 638-642 ◽  
pp. 3811-3818
Author(s):  
Mao Wu ◽  
Xin Bo He ◽  
Shu Bin Ren ◽  
Ming Li Qin ◽  
Xuan Hui Qu
Keyword(s):  
Growth Rate ◽  
Shear Strength ◽  
Intermetallic Compound ◽  
Solder Joint ◽  
Aging Time ◽  
Microstructure Evolution ◽  
Thermal Stresses ◽  
Solder Joints ◽  
Electroless Ni

A novel Sn-2.5Ag-2.0Ni alloy has been developed for soldering of SiCp/Al composites substrate with various types of Ni coatings. An investigation about electroplated Ni layer, electroless Ni-5 wt.% P, Ni-10wt.% P and Ni-B layers has been carried out. It is found that the solder joints possess a single intermetallic compound (IMC) Ni3Sn4, which coarsens with an increase in aging time. The formation of Ni2SnP has been observed to significantly affect the reliability of the solder joints. But the formation of Ni2SnP can be suppressed by lowering the P contents in as-deposited Ni coatings. It has been also found that the thermal stresses generated in solder joint increases with the decrease of P contents in Ni-P layer. Furthermore, the concentration of thermal stresses in the electroplated Ni solder joint is found to be higher than that in other three electroless Ni layers. Out of four as-deposited Ni coatings, the Ni-B layer exhibits good wettability with solder and low IMC growth rate during aging. Also, the shear strength of solder joint decreases with an increase in aging time and Ni-B solder joint demonstrates the highest shear strength after long term aging.

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