Microstructural evolution of a lead-free solder alloy Sn-Bi-Ag-Cu prepared by mechanical alloying during thermal shock and aging
2000 ◽
Vol 29
(8)
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pp. 1021-1026
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2000 ◽
Vol 29
(8)
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pp. 1015-1020
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2020 ◽
Vol 43
(12)
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pp. 2883-2891
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2006 ◽
Vol 41
(12)
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pp. 1210-1213
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2018 ◽
Vol 71
(11)
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pp. 2855-2859
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2019 ◽
Vol 6
(12)
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pp. 126562
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2005 ◽
Vol 160
(7)
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pp. 301-312
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2012 ◽
Vol 53
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pp. 1770-1774
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