multiple reflow cycles
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Microstructure evolution of Sn-Cu based solder paste on electroless nickel immersion gold (ENIG) surface finish subjected to multiple reflow cycles

2021 ◽  
Author(s):  
Rita Mohd Said ◽  
Muhammad Alif Haikal Abdul Ghani ◽  
Norainiza Saud ◽  
Mohd Arif Anuar Mohd Salleh
Keyword(s):  
Microstructure Evolution ◽  
Surface Finish ◽  
Electroless Nickel ◽  
Solder Paste ◽  
Electroless Nickel Immersion Gold ◽  
Multiple Reflow Cycles

Performance of MWCNT-Reinforced SAC0307/Cu Solder Joint Under Multiple Reflow Cycles

2018 ◽  
Vol 71 (11) ◽  
pp. 2693-2698 ◽  
Author(s):  
Sanjay Tikale ◽  
K. Narayan Prabhu
Keyword(s):  
Solder Joint ◽  
Multiple Reflow Cycles

Microstructure Evolution of Sn-Cu Based Solder Paste with Different Cu Concentration Subjected to Multiple Reflows

2018 ◽  
Vol 280 ◽  
pp. 206-211 ◽  
Author(s):  
Rita Mohd Said ◽  
Mohd Arif Anuar Mohd Salleh ◽  
Nur Ain Athirah Amran ◽  
Mohd Izrul Izwan Ramli
Keyword(s):  
Intermetallic Compound ◽  
Microstructure Evolution ◽  
Bulk Solder ◽  
Solder Paste ◽  
Microstructure Formation ◽  
Cu Content ◽  
Microstructure Morphology ◽  
Solder Microstructure ◽  
Multiple Reflow Cycles ◽  
Solder Composition

The evolution in microstructure of Sn-Cu based solder paste with different copper (Cu) content subjected to multiple reflow cycles was investigated. In this study, the Sn-0.7Cu (SC) solder paste was used as based material. The Cu particles were added into SC solder paste to produce new Sn-4Cu and Sn-10Cu solder paste. After that, the solder paste was then reflowed on Cu-OSP surface finished and subjected to six times reflows. Characterization focuses on the bulk solder microstructure, morphology and intermetallic compound (IMC) thickness after multiple reflows. Results reveal that solder composition significantly affect the microstructure formation and growth of IMC.

scholarly journals Suppression of Cu 6 Sn 5 in TiO 2 reinforced solder joints after multiple reflow cycles

2016 ◽  
Vol 108 ◽  
pp. 418-428 ◽  
Author(s):  
M.A.A. Mohd Salleh ◽  
S.D. McDonald ◽  
C.M. Gourlay ◽  
H. Yasuda ◽  
K. Nogita
Keyword(s):  
Solder Joints ◽  
Multiple Reflow Cycles

Effect of multiple reflow cycles on ball impact responses of Sn‐Ag‐Cu solder joints

2009 ◽  
Vol 21 (3) ◽  
pp. 4-9
Author(s):  
Yi‐Shao Lai ◽  
C.R. Kao ◽  
Hsiao‐Chuan Chang ◽  
Chin‐Li Kao
Keyword(s):  
Solder Joints ◽  
Ball Impact ◽  
Impact Responses ◽  
Multiple Reflow Cycles
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