Characterization of Stress–Strain Response of Lead-Free Solder Joints Using a Digital Image Correlation Technique and Finite-Element Modeling

2012 ◽  
Vol 42 (2) ◽  
pp. 294-303 ◽  
Author(s):  
G. Khatibi ◽  
M. Lederer ◽  
E. Byrne ◽  
A. Betzwar Kotas ◽  
B. Weiss ◽  
...  
2020 ◽  
pp. 2000376
Author(s):  
Abhay Kumar ◽  
Gudibanda Maruthi Sri Krishna Chaitanya ◽  
Sunil Goyal ◽  
Mohit Goswami ◽  
Anish Kumar ◽  
...  

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