Characterization of Stress–Strain Response of Lead-Free Solder Joints Using a Digital Image Correlation Technique and Finite-Element Modeling
2012 ◽
Vol 42
(2)
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pp. 294-303
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2012 ◽
Vol 96
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pp. 107-121
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2020 ◽
Vol 8
(1)
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pp. 8
2020 ◽
Vol 260
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pp. 119819
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2014 ◽
Vol 63
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pp. 30-42
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2017 ◽
Vol 322
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pp. 1-9
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