Optical projection system design for photoresist exposure

1970 ◽  
Vol 9 (3) ◽  
pp. 220-221
1969 ◽  
Vol 8 (1) ◽  
pp. 75 ◽  
Author(s):  
Milton D. Rosenau ◽  
Robert A. Jones ◽  
Leon Contente

1972 ◽  
Vol 16 ◽  
pp. 336-343
Author(s):  
David G. Grant

AbstractTomographic systems are able to produce cross sectional planar images of three dimensional volumes because of the relative motion of the source, film and the volume under examination. Analysis shows that the image produced is a result of a three dimensional linear filtering process where the filter characteristics are determined by the scan geometry (3). If, instead of integrating continuously on a single film, a set of N radiographs are recorded, each corresponding to a point along the scan trajectory, then a simple filter can be defined to reconstruct the entire three dimensional structure from this data. In this case, the transfer function exhibits repetitive peaks whose spacing is determined by N and whose width is determined by the total scan length. The number of views required to produce the same “blurring” as the continuous case can then be determined by the Nyquist criteria(3).An optical projection system based on circular geometry for producing three dimensional medical images has been fabricated and tested. The technique can be generalized to any geometry and to all x-ray applications where plane-by-plane examination of a structure would prove beneficial.


2014 ◽  
Vol 2014 (1) ◽  
pp. 000178-000183 ◽  
Author(s):  
James Webb ◽  
Roger McCleary ◽  
Gerald Lopez ◽  
Qing Tan

Increasing volume using larger substrates with decreasing process margins create new challenges for advanced packaging applications. Key step and repeat camera technology continues being introduced for the mass production of high density interconnects used for 2.5D and 3D technologies that will provide solutions for the challenges encountered. A 2X reduction stepper with unique features achieves the tighter specifications needed for many advanced packaging applications printed on large substrates. A large field-of-view optical projection system utilizes the 350–450nm light spectrum from a mercury arc to expose the circuit patterns from a reticle mask onto a substrate and image features with the optimal fidelity required for advanced packaging technologies. The imaging field prints a large 52mm x 66mm area or 59.4mm x 59.4mm in a single exposure. These features enable a system to process larger substrates in fewer shots which result in higher throughput using lower power. Details of the camera and the adjustments that are provided to extend the range of use for both high power and high fidelity applications are discussed. An extensive evaluation of measured and modeled lithographic capabilities of the step and repeat camera to achieve critical dimensions with precise image placement is provided. Limiting resolution and depth of focus results sampled over the imaging field will be provided and supported with simulation. Results of thin and thick resist patterning will be presented and compared to simulated 3D resist profiles using the MACK4 model.


1982 ◽  
Author(s):  
Rene Vervoordeldonk ◽  
Peter Willemse ◽  
Roel Kramer ◽  
Tony Cowburn

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