Fiducial inference-based failure mechanism consistency analysis for accelerated life and degradation tests

2022 ◽  
Author(s):  
Kai Song ◽  
Lirong Cui
Keyword(s):  
Failure Mechanism ◽  
Consistency Analysis ◽  
Fiducial Inference ◽  
Accelerated Life ◽  
Degradation Tests

Role of Failure-Mechanism Identification in Accelerated Testing

1993 ◽  
Vol 36 (4) ◽  
pp. 39-45
Author(s):  
J. Hu ◽  
D. Barker ◽  
A. Dasgupta ◽  
A. Arora
Keyword(s):  
Failure Mechanism ◽  
Failure Mechanisms ◽  
Electronic Devices ◽  
Operating Conditions ◽  
Accelerated Life Testing ◽  
Accelerated Testing ◽  
Normal Operating ◽  
Accelerated Life ◽  
Cut Method

Accelerated life testing techniques provide a short-cut method to investigate the reliability of electronic devices with respect to certain dominant failure mechanisms that occur under normal operating conditions. However, accelerated tests have often been conducted without knowledge of the failure mechanisms and without ensuring that the test accelerated the same mechanism as that obscrved under normal operating conditions. This paper summarizes common failure mechanisms in electronic devices and packages and investigates possible failure mechanism shifting during accelerated testing.

Identifying the failure mechanism in accelerated life tests by two-parameter lognormal distributions

2014 ◽  
Vol 35 (8) ◽  
pp. 084010 ◽  
Author(s):  
Chunsheng Guo ◽  
Yanfeng Zhang ◽  
Ning Wan ◽  
Hui Zhu ◽  
Shiwei Feng
Keyword(s):  
Failure Mechanism ◽  
Lognormal Distributions ◽  
Accelerated Life Tests ◽  
Accelerated Life ◽  
Life Tests ◽  
Two Parameter

On the role of tin underlays for the prevention of thermal grooving in thin gold films

1986 ◽  
Vol 44 ◽  
pp. 732-733
Author(s):  
Jin Young Kim ◽  
R. E. Hummel ◽  
R. T. DeHoff
Keyword(s):  
Thin Film ◽  
Free Surface ◽  
Grain Boundary ◽  
Beneficial Effect ◽  
Failure Mechanism ◽  
Failure Mechanisms ◽  
Distinct Advantage ◽  
Gold Films ◽  
Gold Thin Film

Gold thin film metallizations in microelectronic circuits have a distinct advantage over those consisting of aluminum because they are less susceptible to electromigration. When electromigration is no longer the principal failure mechanism, other failure mechanisms caused by d.c. stressing might become important. In gold thin-film metallizations, grain boundary grooving is the principal failure mechanism.Previous studies have shown that grain boundary grooving in gold films can be prevented by an indium underlay between the substrate and gold. The beneficial effect of the In/Au composite film is mainly due to roughening of the surface of the gold films, redistribution of indium on the gold films and formation of In2O3 on the free surface and along the grain boundaries of the gold films during air annealing.

Accelerated Life Modeling of Superpave Mixtures

2014 ◽  
Author(s):  
C. Manandhar ◽  
M. Hossain ◽  
P. Nelson ◽  
C. Hobson
Keyword(s):  
Accelerated Life

Influence of Air Entrappment on Flood Embankment Failure Mechanism - Model Tests

2008 ◽  
Vol 11 (-1) ◽  
pp. 188-201 ◽  
Author(s):  
Piotr Bogacz ◽  
Jarosława Kaczmarek ◽  
Danuta Leśniewska
Keyword(s):  
Failure Mechanism ◽  
Model Tests ◽  
Mechanism Model
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