{111} tilt grain boundaries as barriers for slip transfer in bcc Fe

2022 ◽  
Vol 203 ◽  
pp. 111044
Author(s):  
N. Kvashin ◽  
N. Anento ◽  
D. Terentyev ◽  
A. Serra
Keyword(s):  
Grain Boundaries ◽  
Slip Transfer

Probing the Critical Stress Intensity Factor for Slip Transfer across Grain Boundaries by Subgranular Indentation Alfonso

2000 ◽  
Vol 649 ◽  
Author(s):  
H.W. Ngan ◽  
Y.L. Chiu
Keyword(s):  
Stress Intensity Factor ◽  
Stress Intensity ◽  
Intensity Factor ◽  
Grain Boundary ◽  
Grain Boundaries ◽  
Critical Stress ◽  
Critical Stress Intensity Factor ◽  
Square Root ◽  
Slip Transfer ◽  
Macroscopic Deformation

ABSTRACTBy analysing the relevant results in the literature, we have found that, when indentation is made on a subgranular level, the hardness varies roughly inversely with the square root of the distance between the indent and the grain boundary. This effect is analogous to the Hall-Petch effect for macroscopic deformation.

Slip transfer and plastic strain accumulation across grain boundaries in Hastelloy X

2012 ◽  
Vol 60 (6) ◽  
pp. 1201-1220 ◽  
Author(s):  
Wael Z. Abuzaid ◽  
Michael D. Sangid ◽  
Jay D. Carroll ◽  
Huseyin Sehitoglu ◽  
John Lambros
Keyword(s):  
Plastic Strain ◽  
Grain Boundaries ◽  
Strain Accumulation ◽  
Hastelloy X ◽  
Slip Transfer

Prediction of slip transfer mechanisms across grain boundaries

1989 ◽  
Vol 23 (5) ◽  
pp. 799-803 ◽  
Author(s):  
T.C. Lee ◽  
I.M. Robertson ◽  
H.K. Birnbaum
Keyword(s):  
Grain Boundaries ◽  
Slip Transfer ◽  
Transfer Mechanisms

Slip transfer across grain boundaries in Fe–Si bicrystals

2004 ◽  
Vol 378 (1-2) ◽  
pp. 97-101 ◽  
Author(s):  
J. Gemperlová ◽  
M. Polcarová ◽  
A. Gemperle ◽  
N. Zárubová
Keyword(s):  
Grain Boundaries ◽  
Slip Transfer

Slip transfer across low-angle grain boundaries of deformed Titanium

1995 ◽  
Vol 33 (12) ◽  
pp. 1883-1888 ◽  
Author(s):  
Th. Kehagias ◽  
Ph. Komninou ◽  
G.P. Dimitrakopulos ◽  
J.G. Antonopoulos ◽  
Th. Karakostas
Keyword(s):  
Grain Boundaries ◽  
Slip Transfer

Synchrotron radiation topographic study of slip transfer across grain boundaries in Fe–Si bicrystals

2006 ◽  
Vol 39 (20) ◽  
pp. 4440-4449 ◽  
Author(s):  
M Polcarová ◽  
J Gemperlová ◽  
A Jacques ◽  
J Brádler ◽  
A George
Keyword(s):  
Synchrotron Radiation ◽  
Grain Boundaries ◽  
Slip Transfer

The Slip Transfer Process Through Grain Boundaries in HCP Ti

1993 ◽  
Vol 319 ◽  
Author(s):  
J. Shirokoff ◽  
I.M. Robertson ◽  
H.K. Birnbaum
Keyword(s):  
Grain Boundary ◽  
Slip System ◽  
Grain Boundaries ◽  
Slip Systems ◽  
Boundary Dislocation ◽  
Burgers Vector ◽  
Slip Transfer ◽  
Transmission Electron ◽  
Fcc Materials

AbstractInformation on the mechanisms of slip transfer across grain boundaries in an HCP α-Ti alloy has been obtained from deformation experiments performed In situ in the transmission electron microscope. Initially, lattice dislocations are accommodated within the grain boundary until a critical local dislocation density is reached. The boundary then responds by activating slip in the adjoining grain on the slip system experiencing the highest local resolved shear stress and producing the residual grain-boundary dislocation with the smallest Burgers vector. Slip on secondary slip systems may be initiated provided they reduce the magnitude of the Burgers vector of, or eliminate, the residual grainboundary dislocation. The selection rules used to predict the slip system activated by the grain boundary are the same as apply in ordered and disordered FCC materials.

Nanoindentation study of slip transfer phenomenon at grain boundaries

2009 ◽  
Vol 24 (3) ◽  
pp. 607-615 ◽  
Author(s):  
T.B. Britton ◽  
D. Randman ◽  
A.J. Wilkinson
Keyword(s):  
Grain Boundary ◽  
Grain Boundaries ◽  
Cold Work ◽  
Pure Copper ◽  
Displacement Curve ◽  
Interstitial Free ◽  
Face Centered Cubic ◽  
Slip Transfer ◽  
Individual Contributions ◽  
Face Centered

Nanoindentation was undertaken near grain boundaries to increase understanding of their individual contributions to the material’s macroscopic mechanical properties. Prior work with nanoindentation in body-centered cubic (bcc) materials has shown that some grain boundaries produce a “pop-in” event, an excursion in the load–displacement curve. In the current work, grain boundary associated pop-in events were observed in a Fe–0.01 wt% C polycrystal (bcc), and this is characteristic of high resistance to intergranular slip transfer. Grain boundaries with greater misalignment of slip systems tended to exhibit greater resistance to slip transfer. Grain boundary associated pop-ins were not observed in pure copper (face-centered cubic) or interstitial free steel ~0.002 wt% C (bcc). Additionally, it was found that cold work of the Fe–0.01 wt% C polycrystal immediately prior to indentation completely suppressed grain boundary associated pop-in events. It is concluded that the grain boundary associated pop-in events are directly linked to interstitials pinning dislocations on or near the boundary. This links well with macroscopic Hall–Petch effect observations.

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