The heat generated by a high-power device will seriously affect the operating efficiency and service life of electronic devices, which greatly limits the development of the microelectronic industry. Carbon fiber (CF) materials with excellent thermal conductivity have been favored by scientific researchers. In this paper, CF/carbon felt (CF/C felt) was fabricated by CF and phenolic resin using the “airflow network method”, “needle-punching method” and “graphitization process method”. Then, the CF/C/Epoxy composites (CF/C/EP) were prepared by the CF/C felt and epoxy resin using the “liquid phase impregnation method” and “compression molding method”. The results show that the CF/C felt has a 3D network structure, which is very conducive to improving the thermal conductivity of the CF/C/EP composite. The thermal conductivity of the CF/C/EP composite reaches 3.39 W/mK with 31.2 wt% CF/C, which is about 17 times of that of pure epoxy.
Enhanced Thermal Conductivity and Mechanical Toughness of the Epoxy Resin by Incorporation of Mesogens Without Nanofillers
