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G. Krishna Podagatlapalli ◽  
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2017 ◽  
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pp. 0102015 ◽  
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孙明营 Sun Mingying ◽  
时双 Shi Shuang ◽  
潘雪 Pan Xue ◽  
朱健强 Zhu Jianqiang

2018 ◽  
Vol 55 (10) ◽  
pp. 101402
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纪利平 Ji Liping ◽  
宋梓钰 Song Ziyu ◽  
孙亚萍 Sun Yaping ◽  
王兴盛 Wang Xingsheng ◽  
李成玉 Li Chengyu

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S. Venugopal Rao ◽  
G. Krishna Podagatlapalli

Author(s):  
Wenqian Hu ◽  
Galen B. King ◽  
Yung C. Shin

Microhole drilling and microstructure machining with a picosecond (ps) Nd:YVO4 laser (pulse duration of 10 ps) in metals, alloys and ceramics are reported. Blind and through microholes were drilled by percussion drilling as well as trepanning drilling. The diameters of the holes were in the range from 20 μm to 1000 μm. Microfeatures were machined and the flexibility of ps laser machining was demonstrated. The quality of drilled holes, e.g., recast layer, microcrack and conicity, and that of the microstructures, were investigated by optical microscope, surface profilometer, or scanning electron microscope (SEM). Ps laser ablation rate was investigated by experiments as well as a simplified laser ablation model.


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