Analysis of enhanced heat transfer on a passive heat sink with high-emissivity coating

2021 ◽  
Vol 166 ◽  
pp. 106971
Author(s):  
Hongye Zu ◽  
Wei Dai ◽  
Yong Li ◽  
Ke Li ◽  
Jiangtao Li
Keyword(s):  
Heat Transfer ◽  
Heat Sink ◽  
Enhanced Heat Transfer ◽  
High Emissivity

scholarly journals Enhanced heat transfer of heat sink channels with micro pin fin roughened walls

2016 ◽  
Vol 92 ◽  
pp. 617-627 ◽  
Author(s):  
Taiho Yeom ◽  
Terrence Simon ◽  
Tao Zhang ◽  
Min Zhang ◽  
Mark North ◽  
...  
Keyword(s):  
Heat Transfer ◽  
Heat Sink ◽  
Enhanced Heat Transfer ◽  
Pin Fin

Enhanced heat transfer in plate fin heat sink with dimples and protrusions

2019 ◽  
Vol 55 (8) ◽  
pp. 2247-2260 ◽  
Author(s):  
Ayush Gupta ◽  
Manoj Kumar ◽  
Anil Kumar Patil
Keyword(s):  
Heat Transfer ◽  
Heat Sink ◽  
Enhanced Heat Transfer

Analysis of Heat Transfer Enhancement in Micro-scale Heat Sink Structure

2021 ◽  
pp. 1-11
Author(s):  
Long Wei ◽  
Zixuan Song ◽  
Tao Ren ◽  
Yun Liu
Keyword(s):  
Heat Transfer ◽  
Nusselt Number ◽  
Flow Field ◽  
Transfer Factor ◽  
Heat Sink ◽  
Heat Transfer Performance ◽  
Straight Channel ◽  
Transfer Enhancement ◽  
Enhanced Heat Transfer ◽  
Heat Transfer Factor

Abstract With the increasing power requirements of electronic devices, high heat flux will cause serious damage to the devices. Based on the basic theory of micro-nano heat transfer, the series and topological microchannel heat sink models are established. The flow field characteristics and temperature distribution in the heat sink are analyzed by numerical calculation. The effects of channel structure on temperature, pressure drop, the Nusselt number and enhanced heat transfer factor are compared, and the micro-mechanism of heat transfer enhancement in microchannels is clarified. It is found that the Nusselt number of the flow field can be significantly increased by adding the triangular groove in the microchannel, and the enhanced heat transfer factor in the channel can be greatly improved by the topological structure. Further analysis of the factors such as angle a, diameter ratios γ and topological structures of the triangular groove shows that:When α = 70°,the Nusselt number of the flow field is 3.1 times of that of the straight channel, and the enhanced heat transfer factor is 2.7 times of that of it; compared with the straight channel, the comprehensive heat transfer performance of the microchannel with γ = 1/2 is improved by 31%; when using T.Tr.N. topology, the convective heat transfer of the microchannel is 2.6 times of that of the straight channel and the comprehensive heat transfer performance is increased by 5.9 times.

scholarly journals Numerical Study of Fluid Flow and Heat Transfer Characteristics in a Cone-Column Combined Heat Sink

Energies ◽  
2021 ◽  
Vol 14 (6) ◽  
pp. 1605
Author(s):  
Wei Zheng ◽  
Jianjun Sun ◽  
Chenbo Ma ◽  
Qiuping Yu ◽  
Yuyan Zhang ◽  
...  
Keyword(s):  
Heat Transfer ◽  
Heat Sink ◽  
Heat Transfer Performance ◽  
Base Temperature ◽  
Transfer Performance ◽  
Heat Transfer Characteristics ◽  
Enhanced Heat Transfer ◽  
Flow And Heat Transfer ◽  
Heat Transfer Factor ◽  
Circular Microchannel

Temperature has a great influence on the normal operation and service life of high-power electronic components. To cope with the increasingly severe heat problems in integrated circuits, an enhanced heat transfer factor E is introduced to evaluate the comprehensive heat transfer performance of microchannel heat sinks (MCHS). The computational fluid dynamics (CFD) software was used to numerically study the fluid flow and heat transfer characteristics in the cone-column combined heat sink. The research results obtained the velocity field and pressure field distribution of the heat sink structure in the range of 100 ≤ Re ≤ 700. When Re changes, the change law of pressure drop ΔP, friction factor f, average Nussel number Nuave, average substrate temperature T, and enhanced heat transfer factor E, are compared with the circular MCHS. The results show that the uniform arrangement of the cones inside the cone-column combined heat sink can change the flow state of the cooling medium in the microchannel and enhance the heat transfer. In the range of 100 ≤ Re ≤ 700, the base temperature of the cone-column combined heat sink is always lower than the base temperature of the circular MCHS, and the average Nusselt number Nuave is as high as 2.13 times that of the circular microchannel. The enhanced heat factor E is 1.75 times that of the circular MCHS, indicating that the comprehensive heat transfer performance of the cone-column combined heat sink is significantly better than that of the circular microchannel.

Design and Analysis: Thermal Emulator Cubes for Opto-Electronic Stacked Processor

2002 ◽  
Vol 124 (3) ◽  
pp. 198-204 ◽  
Author(s):  
Shiva P. Gadag ◽  
Susan K. Patra ◽  
Volkan Ozguz ◽  
Phillipe Marchand ◽  
Sadik Esener
Keyword(s):  
Heat Transfer ◽  
Thermal Analysis ◽  
Heat Sink ◽  
Solder Joints ◽  
Thin Sheet ◽  
Heat Extraction ◽  
Heat Transfer Analysis ◽  
Enhanced Heat Transfer ◽  
Micro Channels ◽  
Flex Cable

3D finite element modeling of thermal emulator cube and its composition consisting of composite stack of multi-layer chip are developed. Thermal analysis of the Multi-Chip Module consisting of 16 alternate layers Si processor and heat sink layers with Si spacers and AlN ceramic cap is undertaken. The various alternatives for design of the emulator cubes such as thermal cube floating in free-space, thermal cube-on-substrate, thermal cube-on-flex cable with a continuous joint of solder and thermal cube embedded in rectangular Si-spacer are investigated for their heat extraction capability. Thermal modeling of a composite structural unit stack of chip offers first hand information as to the operating performance of the entire thermal emulator cube to be used in the construction of buffer cube. The scientific understanding of the mode of heat transfer of the emulator cube, heat extraction of the various heat sink materials, ceramic and the metallic substrates are investigated. A thin sheet of ceramic (AlN) substrate is at least three times more effective in extraction of heat than thick block of steel under similar conditions. The homogeneous and heterogeneous nature of the composite structure of thermal emulator in heat transfer is analyzed. The primary and secondary hotspots in thermal cubes with AlN heat sink are found in thermal simulations. The mode of heat transfer advances normal to lateral and transverse directions of stacking from the central core of the cube towards the outward face. The sharp corners of the cube typically exhibit edge convection due to chilling effect. Buffer-on-flex cable is modeled with a continuous solder joint and its further improvement with alternate hinges of solder joints and micro-channels is proposed for enhanced heat transfer analysis. The embedded emulator cubes are developed for thermal analysis of the optical layers on top of buffer. The optical layers with an interconnection of solder joints on top of the embedded emulator cubes coupled with micro-channels and hinged solder joints will be used for further enhanced heat transfer and higher dissipation of heat 1∼3W/layer resulting in efficient and cost effective thermal management technique.

Active Upstream Components for Enhanced Heat Transfer of Longitudinally Finned Heat Sinks

2010 ◽  
Author(s):  
John Daly
Keyword(s):  
Heat Transfer ◽  
Forced Convection ◽  
Heat Sink ◽  
Performance Enhancement ◽  
Heat Sinks ◽  
Air Cooling ◽  
Active Components ◽  
Enhanced Heat Transfer ◽  
Current Standard ◽  
Piezoelectric Fans

With the ever increasing heat flux from next-generation chips forced convection cooling is beginning to reach its limits within current standard heat sink capabilities. Methods of extending the air cooling capabilities prior to a transition to liquid or refrigerant-based cooling which is seen as costly and complex, have become more critical. This paper investigates the enhanced heat transfer by the addition of active components upstream of a longitudinally finned heat sink. This paper addresses piezoelectric fans for natural and forced convection environments. Experimental measurements are taken for a low powered DC fan operating at a frequency of 114Hz. For the forced convection experiments a fully ducted flow was used. The main thrust of the paper is to determine the effects of piezoelectrics in augmenting forced convection systems at hot component locations. The effects on pressure drop, thermal resistance and pumping power with the addition of the technology are presented. The paper concludes by reporting on the performance enhancement and limitations of the piezoelectric fans compared to the conventional longitudinally finned heat sink geometry.

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