2018 24rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)

2018 ◽

Author(s):

S. Da Luz ◽

G. Kattinger ◽

G. Laguna ◽

H. Azarkish ◽

M. Vilarrubi ◽

...

Keyword(s):

Low Power ◽

Microfluidic Chip ◽

Chip Cooling

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Thermo-mechanical reliability of sintered all-Cu electrical fine pitch interconnects under isothermal fatigue testing benchmarked against soldered and TLP-bonded SnAg3.5 joints

2018 24rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) ◽

10.1109/therminic.2018.8593327 ◽

2018 ◽

Author(s):

Akhil Kumar ◽

Uwe Zschenderlein ◽

M. Baum ◽

T. Brunschwiler ◽

Daniel N. Wright ◽

...

Keyword(s):

Fatigue Testing ◽

Mechanical Reliability ◽

Isothermal Fatigue ◽

Fine Pitch

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Vertically Aligned Graphene-based Thermal Interface Material with High Thermal Conductivity

2018 24rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) ◽

10.1109/therminic.2018.8593303 ◽

2018 ◽

Cited By ~ 2

Author(s):

Nan Wang ◽

Shujing Chen ◽

Amos Nkansah ◽

Qianlong Wang ◽

Xitao Wang ◽

...

Keyword(s):

Thermal Conductivity ◽

High Thermal Conductivity ◽

Thermal Interface Material ◽

Thermal Interface ◽

Vertically Aligned

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Thermal Resistance Advanced Calculator (TRAC)

2018 24rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) ◽

10.1109/therminic.2018.8593333 ◽

2018 ◽

Cited By ~ 2

Author(s):

Lorenzo Codecasa ◽

Salvatore Race ◽

Vincenzo d'Alessandro ◽

Donata Gualandris ◽

Arianna Morelli ◽

...

Keyword(s):

Thermal Resistance

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Enhanced Heat Transfer in Heat Sink Channels using Autonomously Fluttering Reeds

2018 24rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) ◽

10.1109/therminic.2018.8592876 ◽

2018 ◽

Author(s):

Sourabh Jha ◽

Ari Glezer

Keyword(s):

Heat Transfer ◽

Heat Sink ◽

Enhanced Heat Transfer

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Is Less More? Masking Detailed Thermal Model Data to Facilitate the Co-Design Supply Chain

2018 24rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) ◽

10.1109/therminic.2018.8593319 ◽

2018 ◽

Author(s):

John Parry ◽

John Wilson ◽

Byron Blackmore

Keyword(s):

Supply Chain ◽

Thermal Model ◽

Model Data

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Transient thermal storage of excess heat using eutectic BiSn as phase change material for the thermal management of an electronic power module: design, technology, performance and reliability within a system approach

2018 24rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) ◽

10.1109/therminic.2018.8593293 ◽

2018 ◽

Author(s):

B. Wunderle ◽

M. Springborn ◽

D. May ◽

J. Heilmann ◽

C. -A. Manier ◽

...

Keyword(s):

Phase Change ◽

Phase Change Material ◽

Thermal Management ◽

System Approach ◽

Power Module ◽

Design Technology ◽

Excess Heat ◽

Module Design ◽

Transient Thermal ◽

Change Material

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A Close Look on Voids in Solder Joints

2018 24rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) ◽

10.1109/therminic.2018.8593311 ◽

2018 ◽

Author(s):

Katrin Fladischer ◽

Lisa Mitterhuber ◽

Elke Kraker ◽

Daniel Ginter ◽

Jordis Rosc ◽

...

Keyword(s):

Solder Joints

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Thermal Design for Six Sigma of an Imaging Device with Dynamic Thermal Management

2018 24rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) ◽

10.1109/therminic.2018.8593324 ◽

2018 ◽

Cited By ~ 1

Author(s):

Wendy Luiten

Keyword(s):

Thermal Management ◽

Six Sigma ◽

Thermal Design ◽

Imaging Device ◽

Dynamic Thermal Management ◽

Design For Six Sigma

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Precision Measurement of Thermal Diffusivity for Thin Layers by a Customised Laser Pulse Method

2018 24rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) ◽

10.1109/therminic.2018.8593291 ◽

2018 ◽

Author(s):

Benedict Volker ◽

Daniel May ◽

Mohamad Abo Ras ◽

Corinna Grosse ◽

Bernhard Wunderle ◽

...

Keyword(s):

Thermal Diffusivity ◽

Laser Pulse ◽

Precision Measurement ◽

Pulse Method ◽

Thin Layers ◽

Laser Pulse Method

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2018 24rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)
Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Variable Pumping Control for Low Power Microfluidic Chip Cooling

Thermo-mechanical reliability of sintered all-Cu electrical fine pitch interconnects under isothermal fatigue testing benchmarked against soldered and TLP-bonded SnAg3.5 joints

Vertically Aligned Graphene-based Thermal Interface Material with High Thermal Conductivity

Thermal Resistance Advanced Calculator (TRAC)

Enhanced Heat Transfer in Heat Sink Channels using Autonomously Fluttering Reeds

Is Less More? Masking Detailed Thermal Model Data to Facilitate the Co-Design Supply Chain

Transient thermal storage of excess heat using eutectic BiSn as phase change material for the thermal management of an electronic power module: design, technology, performance and reliability within a system approach

A Close Look on Voids in Solder Joints

Thermal Design for Six Sigma of an Imaging Device with Dynamic Thermal Management

Precision Measurement of Thermal Diffusivity for Thin Layers by a Customised Laser Pulse Method

Export Citation Format

2018 24rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Variable Pumping Control for Low Power Microfluidic Chip Cooling

Thermo-mechanical reliability of sintered all-Cu electrical fine pitch interconnects under isothermal fatigue testing benchmarked against soldered and TLP-bonded SnAg3.5 joints

Vertically Aligned Graphene-based Thermal Interface Material with High Thermal Conductivity

Thermal Resistance Advanced Calculator (TRAC)

Enhanced Heat Transfer in Heat Sink Channels using Autonomously Fluttering Reeds

Is Less More? Masking Detailed Thermal Model Data to Facilitate the Co-Design Supply Chain

Transient thermal storage of excess heat using eutectic BiSn as phase change material for the thermal management of an electronic power module: design, technology, performance and reliability within a system approach

A Close Look on Voids in Solder Joints

Thermal Design for Six Sigma of an Imaging Device with Dynamic Thermal Management

Precision Measurement of Thermal Diffusivity for Thin Layers by a Customised Laser Pulse Method

2018 24rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)
Latest Publications