Borehole time domain reflectometry in layered sandstone: Impact of measurement technique on vadose zone process identification

2006 ◽  
Vol 319 (1-4) ◽  
pp. 143-162 ◽  
Author(s):  
L. Jared West ◽  
Steven W. Truss
Keyword(s):  
Measurement Technique ◽  
Vadose Zone ◽  
Time Domain ◽  
Time Domain Reflectometry ◽  
Process Identification

Flexible Time Domain Reflectometry Probe for Deep Vadose Zone Monitoring

2003 ◽  
Vol 2 (2) ◽  
pp. 270-275 ◽  
Author(s):  
Ofer Dahan ◽  
Eric V. McDonald ◽  
Michael H. Young
Keyword(s):  
Vadose Zone ◽  
Time Domain ◽  
Time Domain Reflectometry

Development of Thermo-Time Domain Reflectometry for Vadose Zone Measurements

2003 ◽  
Vol 2 (4) ◽  
pp. 544-551 ◽  
Author(s):  
Tusheng Ren ◽  
Tyson E. Ochsner ◽  
Robert Horton
Keyword(s):  
Vadose Zone ◽  
Time Domain ◽  
Time Domain Reflectometry

Development of Thermo-Time Domain Reflectometry for Vadose Zone Measurements

2003 ◽  
Vol 2 (4) ◽  
pp. 544-551 ◽  
Author(s):  
T. Ren ◽  
T. E. Ochsner ◽  
R. Horton
Keyword(s):  
Vadose Zone ◽  
Time Domain ◽  
Time Domain Reflectometry

Flexible Time Domain Reflectometry Probe for Deep Vadose Zone Monitoring

2003 ◽  
Vol 2 (2) ◽  
pp. 270-275 ◽  
Author(s):  
O. Dahan ◽  
E. V. McDonald ◽  
M. H. Young
Keyword(s):  
Vadose Zone ◽  
Time Domain ◽  
Time Domain Reflectometry

Development of Thermo-Time Domain Reflectometry for Vadose Zone Measurements

2003 ◽  
Vol 2 (4) ◽  
pp. 544 ◽  
Author(s):  
Tusheng Ren ◽  
Tyson E. Ochsner ◽  
Robert Horton
Keyword(s):  
Vadose Zone ◽  
Time Domain ◽  
Time Domain Reflectometry

Flexible Time Domain Reflectometry Probe for Deep Vadose Zone Monitoring

2003 ◽  
Vol 2 (2) ◽  
pp. 270 ◽  
Author(s):  
Ofer Dahan ◽  
Eric V. McDonald ◽  
Michael H. Young
Keyword(s):  
Vadose Zone ◽  
Time Domain ◽  
Time Domain Reflectometry

Advanced Non-Destructive Fault Isolation Techniques for PCB Substrates Using Magnetic Current Imaging and Terahertz Time Domain Reflectometry

2018 ◽  
Author(s):  
Daechul Choi ◽  
Yoonseong Kim ◽  
Jongyun Kim ◽  
Han Kim
Keyword(s):  
Time Domain ◽  
Quantum Interference ◽  
Flip Chip ◽  
Imaging System ◽  
Time Domain Reflectometry ◽  
Fault Isolation ◽  
Magnetic Current ◽  
Isolation Techniques ◽  
Super Conducting ◽  
Non Destructive

Abstract In this paper, we demonstrate cases for actual short and open failures in FCB (Flip Chip Bonding) substrates by using novel non-destructive techniques, known as SSM (Scanning Super-conducting Quantum Interference Device Microscopy) and Terahertz TDR (Time Domain Reflectometry) which is able to pinpoint failure locations. In addition, the defect location and accuracy is verified by a NIR (Near Infra-red) imaging system which is also one of the commonly used non-destructive failure analysis tools, and good agreement was made.

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