The application of an analytical model to solve an inverse heat conduction problem: Transient solidification of a Sn-Sb peritectic solder alloy on distinct substrates

2019 ◽  
Vol 48 ◽  
pp. 164-173 ◽  
Author(s):  
Joanisa P. Curtulo ◽  
Marcelino Dias ◽  
Felipe Bertelli ◽  
Bismarck L. Silva ◽  
José E. Spinelli ◽  
...  
2015 ◽  
Vol 2015 ◽  
pp. 1-8 ◽  
Author(s):  
Muhammad Arghand ◽  
Majid Amirfakhrian

We propose a new meshless method to solve a backward inverse heat conduction problem. The numerical scheme, based on the fundamental solution of the heat equation and radial basis functions (RBFs), is used to obtain a numerical solution. Since the coefficients matrix is ill-conditioned, the Tikhonov regularization (TR) method is employed to solve the resulted system of linear equations. Also, the generalized cross-validation (GCV) criterion is applied to choose a regularization parameter. A test problem demonstrates the stability, accuracy, and efficiency of the proposed method.


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