Oxidation behaviour and microstructure evolution of Zr-containing steel under continuous high-temperature exposure

2021 ◽  
pp. 125324
Author(s):  
Shuai Wang ◽  
Kaihong Zheng ◽  
Zhibin Zheng ◽  
Jun Long ◽  
Juan Wang
Keyword(s):  
High Temperature ◽  
Microstructure Evolution ◽  
Oxidation Behaviour ◽  
High Temperature Exposure ◽  
Temperature Exposure

Microstructure Evolution of Nd2O3 and Yb2O3 Co-Doped YSZ Thermal Barrier Coatings during High Temperature Exposure

2007 ◽  
Vol 546-549 ◽  
pp. 1735-1738 ◽  
Author(s):  
Qiu Li Wei ◽  
Hong Bo Guo ◽  
Sheng Kai Gong
Keyword(s):  
High Temperature ◽  
Thermal Barrier Coatings ◽  
Microstructure Evolution ◽  
Physical Vapor Deposition ◽  
Thermal Barrier ◽  
Barrier Coatings ◽  
High Temperature Exposure ◽  
Ysz Coating ◽  
Temperature Exposure ◽  
Co Doped

10mol% Nd2O3 and Yb2O3 co-doped YSZ thermal barrier coatings were produced by electron beam physical vapor deposition (EB-PVD). Compared to the traditional YSZ coating, the deposited coating has shown tree-like microstructure in each column. Due to this, the co-doped coating is more porous than the YSZ coating. The microstructure evolution of the coating during high temperature exposure at 1373 K was studied. The tree-like microstructure disappeared due to joining of sub-grains during sintering. Thermal growth oxide (TGO) grew quickly at the first few hours and then the growth of TGO became slow in the subsequent high temperature exposure. Cracks generated and propagated in the ceramic top coat and along the interface of the top coat and TGO layer. Finally, the coalescence of such cracks resulted in failure of the TBCs.

Creep Properties and Interfacial Microstructure of SiC Whisker Reinforced Si3N4

1989 ◽  
Vol 170 ◽  
Author(s):  
Håkan A. Swan ◽  
Colette O'meara
Keyword(s):  
High Temperature ◽  
Creep Resistance ◽  
Interfacial Microstructure ◽  
Deformation Mechanisms ◽  
Amorphous Films ◽  
Creep Tests ◽  
Creep Properties ◽  
High Temperature Exposure ◽  
Temperature Exposure

AbstractPreliminary creep tests were performed on SiC whisker reinforced and matrix Si3N4 material fabricated by the NPS technique. The material was extensively crystallised in the as received material, leaving only thin amorphous films surrounding the grains. No improvement in the creep resistance could be detected for the whisker reinforced material. The deformation mechanisms were found to be that of cavitation in the form of microcracks, predominantly at the whisker/matrix interfaces, and the formation of larger cracks. Extensive oxidation of the samples, as a result of high temperature exposure to air, was observed for the materials tested at 1375°C.

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