Microstructure and mechanical properties of Pb-free Sn–3.0Ag–0.5Cu solder pastes added with NiO nanoparticles after reflow soldering process

2016 ◽  
Vol 90 ◽  
pp. 499-507 ◽  
Author(s):  
Srivalli Chellvarajoo ◽  
M.Z. Abdullah
2016 ◽  
Vol 238 ◽  
pp. 290-296 ◽  
Author(s):  
Yang Liu ◽  
Haifeng Fu ◽  
Fenglian Sun ◽  
Hao Zhang ◽  
Xiangxia Kong ◽  
...  

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