The effect of temperature and strain rate on the tensile properties of a Sn99.3Cu0.7(Ni) lead-free solder alloy

2007 ◽  
Vol 84 (1) ◽  
pp. 144-150 ◽  
Author(s):  
Fulong Zhu ◽  
Honghai Zhang ◽  
Rongfeng Guan ◽  
Sheng Liu
Keyword(s):  
Strain Rate ◽  
Tensile Properties ◽  
Solder Alloy ◽  
Lead Free ◽  
Effect Of Temperature ◽  
Lead Free Solder ◽  
Lead Free Solder Alloy ◽  
Free Solder

Contact Angle of Sn-8Zn-3Bi Lead-free Solder Alloy on Copper Substrate

2020 ◽  
Vol 30 (7) ◽  
pp. 49-53
Author(s):  
Ngoc Binh Duong
Keyword(s):  
Surface Roughness ◽  
Contact Angle ◽  
Solder Alloy ◽  
Copper Substrate ◽  
Lead Free ◽  
Effect Of Temperature ◽  
Lead Free Solder ◽  
Experimental Conditions ◽  
Lead Free Solder Alloy ◽  
Free Solder

The wettability of Sn-8Zn-3Bi lead free solder alloy on the copper substrate was evaluated via measuring the contact angle of the solder and the substrate. The measured contact angle was then compared to the contact angle of the traditional and widely used eutectic Sn-37Pb solder alloy. Experiments to study the effect of temperature, flux, and surface roughness of the substrate on the contact angle were also carried out. The results show that the contact angle of Sn-8Zn-3Bi on copper substrate decreased as temperature increases. The minimum value of the contact angle obtained was approximately 23° for Sn-8Zn-3Bi. At the same experimental conditions, contact angle of Sn-8Zn-3Bi is higher than that of Sn-37Pb. When three types of fluxes were used, at 230°C, contact angle of Sn-8Zn-3Bi has the smallest value with the MHS37 flux, 25°, and it has the largest value with the zinc chloride flux, 47°. The surface roughness of the substrate has little influence on contact angle of Sn-8Zn-3Bi on copperand the contact angle has changed a few degrees as the roughness changed.

A review: Effect of nanoparticles addition on the properties of Sn-Ag-Cu lead free solder alloy

2021 ◽  
Author(s):  
M. N. Ervina Efzan ◽  
M. M. Nur Haslinda ◽  
M. M. Al Bakri Abdullah
Keyword(s):  
Solder Alloy ◽  
Lead Free ◽  
Lead Free Solder ◽  
Lead Free Solder Alloy ◽  
Free Solder

Temperature‐dependent fatigue modelling of a novel Ni, Bi and Sb containing Sn‐3.8Ag‐0.7Cu lead‐free solder alloy

2020 ◽  
Vol 43 (12) ◽  
pp. 2883-2891
Author(s):  
Q.B. Tao ◽  
L. Benabou ◽  
Van Nhat Le ◽  
Ngoc Anh Thi Nguyen ◽  
Hung Nguyen‐Xuan
Keyword(s):  
Solder Alloy ◽  
Lead Free ◽  
Lead Free Solder ◽  
Temperature Dependent ◽  
Lead Free Solder Alloy ◽  
Free Solder
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