Upgrade of an integrated Langmuir probe system on the closed divertor target plates in the HL-2A tokamak

A newly designed divertor Langmuir probe diagnostic system has been installed in a rare closed divertor of the HL-2A tokamak and steadily operated for the study of divertor physics involved edge-localized mode (ELM) mitigation, detachment and redistribution of heat flux, etc. Two sets of probe arrays including 274 probe tips were placed at two ports (approximately 180° separated toroidally), and the spatial and temporal resolutions of this measurement system could reach 6 mm and 1 s, respectively. A novel design of the ceramic isolation ring can ensure reliable electrical insulation property between the graphite tip and the copper substrate plate where plasma impurities and the dust are deposited into the gaps for a long experimental time. Meanwhile, the condition monitoring and mode conversion between single and triple probe of the probe system could be conveniently implemented via a remote control station. The preliminary experimental result shows that the divertor Langmuir probe system is capable of measuring the high spatiotemporal parameters involved the plasma density, electron temperature, particle flux as well as heat flux during the ELMy H-mode discharges.

A Nickel Coated Copper Substrate as a Hydrogen Evolution Catalyst

Replacing precious metals with low-cost metals is the best solution for large scale production. Copper is known for its excellent conductivity and thermal management applications. When it comes to hydrogen evolution reaction, it is highly unstable, especially in KOH solution. In this paper, we approached a simple method to reduce corrosion and improve the performance by depositing nickel-molybdenum oxide and nickel on copper substrates and the achieved tafel slopes of 115 mV/dec and 117 mV/dec at 10 mA/cm2. While at first, molybdenum oxide coated samples showed better performance after 100 cycles of stability tests, the onset potential rapidly changed. Cu–Ni, which was deposited using the electron gun evaporation (e-gun), has shown better performance with 0.28 V at 10 mA/cm2 and led to stability after 100 cycles. Our results show that when copper is alloyed with nickel, it acts as a promising hydrogen evolution reaction (HER) catalyst.

Influence of the Structural-Phase State of a Copper Substrate upon Modification with Titanium Ions on the Thermal Cyclic Resistance of a Coating Based on Zr-Y-O

The results of investigation of the surface of a copper substrate modified with titanium ions are presented. The phase composition, the structure, and the morphology of the surface of the copper alloy modified by titanium ions have been investigated by X-ray, SEM, and TEM. It has been established that there are the intermetallic phases of the Cu-Ti equilibrium diagram in the surface layer during the treatment of copper by the titanium ions. A multilevel micro- and nanoporous structure is formed in the modified layer. It has been established that the structure-phase state and morphology of the surface layers of copper directly effects on the thermocycler resistance and adhesion of the Zr-Y-O coating. The thermocyclic resistance of the Zr-Y-O coating increases by an order of magnitude, the adhesion to the substrate is 2 times if the substrate surface is treated with titanium ions for 6 min.

Universal Service Systems for Scalable Copper Packaging of Discrete Circuit Components

In the decade of digital electronics, no matter what type is, high-value, high-complexity, high-performance devices (such as the main microprocessor core in smart phones) is undoubtedly crucial. However, simple discrete circuit components (such as capacitors, resistors, diodes, transistors, etc.) are also essential for mobile phones. In order to continue to increase functionality and reliability, reduce size and power consumption, reduce costs, and any function we seek in electronic equipment, there is always the basic principle of squeezing everything onto the same semiconductor chip. However, in some unavoidable situations, not all circuit components can run on the same chip. This service system uses a copper substrate as the core material for packaging, and can package chips with high bonding density. It provides a universal service platform for packaged products called: Scalable Universal Copper-based Packaging (CopperPak) service system. This service system is attributed to copper-based packaging (CopperPak) as a solution for expansion packaging, which can package the chip on the multifunctional component as much as possible. Scalable universal copper-based packaging (CopperPak) service system, including miniature copper-based packaging (TyniCopk) and large-scale copper-based packaging (MassyCopk) modules, used to package discrete circuit components, not only solve the discrete circuit components size, heat transfer and positioning alignment issues, and simplify the packaging process and improve yield rate.

Research of the influence of bias voltage on the structure and residual stress in Ta/W coatings applied on a copper substrate by inverted magnetron

This paper presents the results of studying the effect of the bias voltage on a copper tube substrate on the texture and residual stresses in 4-layer Ta/W/Ta/W coatings deposited with an inverted magnetron. It is shown that, in contrast to monolayer coatings of Ta and W, in which residual stresses exceeding 2 GPa are formed on the substrate at high voltages on the substrate, stress relaxations occur in the 4-layer coating in alternating layers differing in LTEC values and in the outer W-layer of stress practically absent.

Electrodeposition of Cu2O thin Film Onto Copper Substrate by Linear Sweep Voltammetry at Low Duration: Effect of Bath pH

Copper (II) oxide (Cu2O) has attracted much interest as a semiconductor material for solar cell applications. Here we report the synthesis of Cu2O, thin films through an economical and simple electrodeposition method at low duration (10 min) by linear sweep voltammetry (LSV) method at 50 °C bath temperature, with the use of citric acid as a complexing agent. The influence of pH value (pH = 9.5, 10.5, 11.5, and 12.5) on structural, morphological, and optical properties of the synthesized Cu2O thin films onto copper substrate was investigated. The synthesized Cu2O thin films have been characterized using various techniques like X-ray diffraction (XRD), Raman spectroscopy, Scanning Electron Microscopy (SEM-EDX), UV-vis spectrophotometry. The X-ray diffraction showed that the deposited thin films at pH= 9.5, 10.5, 11.5 matched well with the cubic (Pn-3m) structure and showed an improvement of the crystallinity near the value pH=10.5. Raman spectroscopy confirms the cubic structure of the synthesized thin film. Thin films show a high absorption coefficient in the visible spectra, and the calculated band gap energy value is near 1.8 eV.

Thermal and Mechanical Properties of Sn-8Zn-3Bi Solder Alloy

Thermal and mechanical properties of Sn-8Zn-3Bi solder alloy on copper substrate were evaluated via measuring the melting temperature, the coefficient of thermal expansion (CTE), the tensile and shear strength of the solder joint. The measured properties of the alloy were then compared to the properties of the traditional and widely used eutectic Sn-37Pb solder alloy. The results show that the melting (liquidus) temperature of Sn-8Zn-3Bi was 195 °C, the CTE of Sn-8Zn-3Bi was 22.2´10-6 K-1 in the temperature range of 30-130 °C. At the same testing condition, both tensile and shear strength of Sn-8Zn-3Bi joints were higher than those of Sn-37Pb. The stress-strain curve indicated that the Sn-8Zn-3Bi joints were brittle whilst the Sn-37Pb joints were ductile.