Contact Angle of Sn-8Zn-3Bi Lead-free Solder Alloy on Copper Substrate

The wettability of Sn-8Zn-3Bi lead free solder alloy on the copper substrate was evaluated via measuring the contact angle of the solder and the substrate. The measured contact angle was then compared to the contact angle of the traditional and widely used eutectic Sn-37Pb solder alloy. Experiments to study the effect of temperature, flux, and surface roughness of the substrate on the contact angle were also carried out. The results show that the contact angle of Sn-8Zn-3Bi on copper substrate decreased as temperature increases. The minimum value of the contact angle obtained was approximately 23° for Sn-8Zn-3Bi. At the same experimental conditions, contact angle of Sn-8Zn-3Bi is higher than that of Sn-37Pb. When three types of fluxes were used, at 230°C, contact angle of Sn-8Zn-3Bi has the smallest value with the MHS37 flux, 25°, and it has the largest value with the zinc chloride flux, 47°. The surface roughness of the substrate has little influence on contact angle of Sn-8Zn-3Bi on copperand the contact angle has changed a few degrees as the roughness changed.

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Wettability of Molten Sn-Zn-Bi Solder on Cu Substrate Ervina Efzan

Applied Mechanics and Materials ◽

10.4028/www.scientific.net/amm.315.675 ◽

2013 ◽

Vol 315 ◽

pp. 675-680 ◽

Cited By ~ 5

Author(s):

Efzan M.N. Ervina ◽

S.Y. Tan

Keyword(s):

Contact Angle ◽

Solder Alloy ◽

Copper Substrate ◽

Lead Free ◽

Lead Free Solder ◽

Reflow Temperature ◽

Ε Phase ◽

Lead Free Solder Alloy ◽

Free Solder ◽

Significant Increment

This work presents the studies of wettability Sn-6Zn-4Bi lead-free solder alloy in electronic applications. A reference solder Sn-3.1Ag-0.9 Cu lead-free solder alloy is used to compare the properties of both solders. Differential Scanning Calorimeter (DSC) profile, wettability and the microstructure of the solder were investigated. The melting temperature of Sn-Zn-Bi (Tm=194.97°C) is lower than Sn-Ag-Cu (Tm=220.40°C). Further, the wettability between molten solder and copper substrate was measured at different reflow temperature. The contact angle for Sn-Ag-Cu was decreasing from 28.23º to 24.97º and for Sn-Zn-Bi solder alloys were decreasing from 48.92º to 29.78º as the temperature increased from 230°C to 250°C. A significant increment of contact angle for Sn-Zn-Bi at 270°C and the contact angle did not change at 270°C for Sn-Ag-Cu. The result of spreading area is inversed with the contact angle. The layers of intermetallic compound were examined by energy-dispersive X-ray. The Sn-Zn-Bi solder exhibits a mixture of Cu-Sn+Cu-Zn phase and ϒ-Cu5Zn8phase. The Sn-Ag-Cu solder exhibits Cu6Sn5 (η-phase) and Cu3Sn (ε-phase). As a conclusion, Sn-Zn-Bi is a potential lead-free solder to develop based on its wettability properties than previous available solder materials.

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The effect of temperature and strain rate on the tensile properties of a Sn99.3Cu0.7(Ni) lead-free solder alloy

Microelectronic Engineering ◽

10.1016/j.mee.2006.09.031 ◽

2007 ◽

Vol 84 (1) ◽

pp. 144-150 ◽

Cited By ~ 34

Author(s):

Fulong Zhu ◽

Honghai Zhang ◽

Rongfeng Guan ◽

Sheng Liu

Keyword(s):

Strain Rate ◽

Tensile Properties ◽

Solder Alloy ◽

Lead Free ◽

Effect Of Temperature ◽

Lead Free Solder ◽

Lead Free Solder Alloy ◽

Free Solder

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Wettability and Bond Shear Strength of Sn-9Zn Lead-Free Solder Alloy Reflowed on Copper Substrate

Materials Science Forum ◽

10.4028/www.scientific.net/msf.830-831.215 ◽

2015 ◽

Vol 830-831 ◽

pp. 215-218 ◽

Cited By ~ 2

Author(s):

Sanjay Tikale ◽

Mrunali Sona ◽

K.N. Prabhu

Keyword(s):

Shear Strength ◽

Solder Alloy ◽

Copper Substrate ◽

Bulk Solder ◽

Lead Free ◽

Lead Free Solder ◽

Reflow Time ◽

Bond Shear Strength ◽

Lead Free Solder Alloy ◽

Free Solder

Lead-free solders are environment friendly and are in great demand for microelectronic applications. In the present study, Sn-9Zn lead free solder alloy was solidified on Cu substrate for different reflow times from 10 to 1000s. The influence of reflow time on wetting, formation of intermetallic compounds (IMCs) and bond shear strength was studied using dynamic contact angle analyzer, bond tester and scanning electron microscopy. The results indicate that, the wettability of the solder alloy increased with increase in reflow time. Microstructure study revealed the presence of Cu5Zn8 and CuZn5 IMCs at the interface. The thickness of an IMC increased with increase in the reflow time. The mean thickness of about 11μm for Cu5Zn8 IMC layer was observed for the reflow time of 1000s. The thickness of CuZn5 layer increased up to a reflow time of 100s and decreases thereafter. The bond shear strength increased up to 100s and decreased with increase in reflow time. The decrement in shear strength at higher reflow time is mainly due to excessive thickness of Cu5Zn8 IMC layer and diffusion of Sn from bulk solder towards the substrate. The excessive thick IMC layer exhibited pre micro-cracks led to the brittle failure of bond under the influence of shear stress.

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Spreading Behaviour and Joint Reliability of Sn–0.3Ag–0.7Cu Lead-Free Solder Alloy on Nickel Coated Copper Substrate as a Function of Reflow Time

Transactions of the Indian Institute of Metals ◽

10.1007/s12666-015-0640-7 ◽

2015 ◽

Vol 68 (6) ◽

pp. 1027-1031 ◽

Cited By ~ 5

Author(s):

Mrunali Sona ◽

K. Narayan Prabhu

Keyword(s):

Solder Alloy ◽

Copper Substrate ◽

Lead Free ◽

Lead Free Solder ◽

Reflow Time ◽

Joint Reliability ◽

Lead Free Solder Alloy ◽

Free Solder

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Wettability and strength of In–Bi–Sn lead-free solder alloy on copper substrate

Journal of Alloys and Compounds ◽

10.1016/j.jallcom.2010.07.182 ◽

2010 ◽

Vol 507 (1) ◽

pp. 290-296 ◽

Cited By ~ 47

Author(s):

Ervina Efzan Mhd Noor ◽

Nurulakmal Mohd Sharif ◽

Cheong Kuan Yew ◽

Tadashi Ariga ◽

Ahmad Badri Ismail ◽

...

Keyword(s):

Solder Alloy ◽

Copper Substrate ◽

Lead Free ◽

Lead Free Solder ◽

Lead Free Solder Alloy ◽

Free Solder

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Effect of Cooling Rate on Joint Shear Strength of Sn-9Zn Lead-Free Solder Alloy Reflowed on Copper Substrate

Materials Performance and Characterization ◽

10.1520/mpc20160058 ◽

2017 ◽

Vol 6 (1) ◽

pp. MPC20160058

Author(s):

Sanjay Tikale ◽

Mrunali Sona ◽

K. Narayan Prabhu

Keyword(s):

Shear Strength ◽

Cooling Rate ◽

Solder Alloy ◽

Copper Substrate ◽

Lead Free ◽

Lead Free Solder ◽

Joint Shear Strength ◽

Lead Free Solder Alloy ◽

Joint Shear ◽

Free Solder

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Surface Roughness and Wettability of SAC/CNT Lead Free Solder

Materials Science Forum ◽

10.4028/www.scientific.net/msf.857.73 ◽

2016 ◽

Vol 857 ◽

pp. 73-75 ◽

Cited By ~ 2

Author(s):

Norliza Ismail ◽

Roslina Ismail ◽

Nik Khairul Amilin Nik Ubaidillah ◽

Azman Jalar ◽

Norazwani Muhammad Zain

Keyword(s):

Surface Roughness ◽

Contact Angle ◽

Substrate Surface ◽

Copper Substrate ◽

Lead Free ◽

Lead Free Solder ◽

Solder Paste ◽

Cu Substrate ◽

Substrate Surface Roughness ◽

Free Solder

The effect of substrate surface roughness on the wettability of SAC237 (Sn 99.9%, Ag 0.3%, Cu 0.7%) with difference percentage of CNT on copper substrate was investigated. Solder paste of SAC 237 without CNT, 0.01% and 0.04% of CNT were reflowed at 270°C on different surface roughness of Cu substrate (abrasive number 240, 400, 600, 800). Contact angle of soldered samples measured by Infinite Focus Microscope (IFM). As a result, contact angle value of investigated solders range 7° to 20°. Contact angle obtained decreases with the increasing surface roughness of Cu substrate. This demonstrates that rougher substrate enhance the wettability of the solders. Addition of CNT also effects the wettability of investigated solders. Higher composition of CNT show better wettability.

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