Enhanced pressureless bonding by Tin Doped Silver Paste at low sintering temperature

2016 ◽  
Vol 660 ◽  
pp. 71-76 ◽  
Author(s):  
Cheng-Xiang Yang ◽  
Xin Li ◽  
Guo-Quan Lu ◽  
Yun-Hui Mei
Keyword(s):  
Sintering Temperature ◽  
Silver Paste ◽  
Low Sintering Temperature

scholarly journals Low Sintering Temperature Nano-Silver Pastes with High Bonding Strength by Adding Silver 2-Ethylhexanoate

Materials ◽  
2021 ◽  
Vol 14 (20) ◽  
pp. 5941
Author(s):  
Steve Lien-Chung Hsu ◽  
Yen-Ting Chen ◽  
Meng-Liang Chen ◽  
In-Gann Chen
Keyword(s):  
Silver Nanoparticles ◽  
Shear Strength ◽  
Sintering Temperature ◽  
Thermal Compression ◽  
Silver Paste ◽  
Nano Silver ◽  
Low Sintering Temperature ◽  
The Relationship ◽  
Proper Condition ◽  
Lower Resistivity

A silver precursor (silver 2-ethylhexanoate) and silver nanoparticles were synthesized and used to prepare a low sintering temperature nano-silver paste (PM03). We optimized the amount of silver 2-ethylhexanoate added and the sintering temperature to obtain the best performance of the nano-silver paste. The relationship between the microstructures and properties of the paste was studied. The addition of silver 2-ethylhexanoate resulted in less porosity, leading to lower resistivity and higher shear strength. Thermal compression of the paste PM03 at 250 °C with 10 MPa pressure for 30 min was found to be the proper condition for copper-to-copper bonding. The resistivity was (3.50 ± 0.02) × 10−7 Ω∙m, and the shear strength was 57.48 MPa.

Significant enhancement ofHc2andHirrin MgB2+C4H6O5bulks at a low sintering temperature of 600 °C

2007 ◽  
Vol 20 (8) ◽  
pp. L51-L54 ◽  
Author(s):  
M S A Hossain ◽  
J H Kim ◽  
X Xu ◽  
X L Wang ◽  
M Rindfleisch ◽  
...  
Keyword(s):  
Sintering Temperature ◽  
Significant Enhancement ◽  
Low Sintering Temperature
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