scholarly journals Low Sintering Temperature Nano-Silver Pastes with High Bonding Strength by Adding Silver 2-Ethylhexanoate

Materials ◽  
2021 ◽  
Vol 14 (20) ◽  
pp. 5941
Author(s):  
Steve Lien-Chung Hsu ◽  
Yen-Ting Chen ◽  
Meng-Liang Chen ◽  
In-Gann Chen
Keyword(s):  
Silver Nanoparticles ◽  
Shear Strength ◽  
Sintering Temperature ◽  
Thermal Compression ◽  
Silver Paste ◽  
Nano Silver ◽  
Low Sintering Temperature ◽  
The Relationship ◽  
Proper Condition ◽  
Lower Resistivity

A silver precursor (silver 2-ethylhexanoate) and silver nanoparticles were synthesized and used to prepare a low sintering temperature nano-silver paste (PM03). We optimized the amount of silver 2-ethylhexanoate added and the sintering temperature to obtain the best performance of the nano-silver paste. The relationship between the microstructures and properties of the paste was studied. The addition of silver 2-ethylhexanoate resulted in less porosity, leading to lower resistivity and higher shear strength. Thermal compression of the paste PM03 at 250 °C with 10 MPa pressure for 30 min was found to be the proper condition for copper-to-copper bonding. The resistivity was (3.50 ± 0.02) × 10−7 Ω∙m, and the shear strength was 57.48 MPa.

Mechanical property and reliability of bimodal nano-silver paste with Ag-coated SiC particles

2019 ◽  
Vol 31 (4) ◽  
pp. 193-202 ◽  
Author(s):  
Qiaoran Zhang ◽  
Abdelhafid Zehri ◽  
Jiawen Liu ◽  
Wei Ke ◽  
Shirong Huang ◽  
...  
Keyword(s):  
Mechanical Property ◽  
Shear Strength ◽  
Sintering Temperature ◽  
Temperature Stability ◽  
High Temperature Stability ◽  
Silver Paste ◽  
Content Type ◽  
Nano Silver ◽  
Sintering Time ◽  
Sic Particles

Purpose This study aims to develop a bimodal nano-silver paste with improved mechanical property and reliability. Silicon carbide (SiC) particles coated with Ag were introduced in nano-silver paste to improve bonding strength between SiC and Ag particles and enhance high-temperature stability of bimodal nano-silver paste. The effect of sintering parameters such as sintering temperature, sintering time and the proportion of SiC particles on mechanical property and reliability of sintered bimodal nano-silver structure were investigated. Design/methodology/approach Sandwich structures consist of dummy chips and copper substrates with nickel and silver coating bonded by nano-silver paste were designed for shear testing. Shear strength testing was conducted to study the influence of SiC particles proportions on the mechanical property of sintered nano-silver joints. The reliability of the bimodal nano-silver paste was evaluated experimentally by means of shear test for samples subjected to thermal aging test at 150°C and humidity and temperature testing at 85°C and 85 per cent RH, respectively. Findings Shear strength was enhanced obviously with the increase of sintering temperature and sintering time. The maximum shear strength was achieved for nano-silver paste sintered at 260°C for 10 min. There was a negative correlation between the proportion of SiC particles and shear strength. After thermal aging testing and humidity and temperature testing for 240 h, the shear strength decreased a little. High-temperature stability and high-hydrothermal stability were improved by the addition of SiC particles. Originality/value Submicron-scale SiC particles coated with Ag were used as alternative materials to replace part of nano-silver particles to prepare bimodal nano-silver paste due to its high thermal conductivity and excellent mechanical property.

scholarly journals Nano-Silver Ink of High Conductivity and Low Sintering Temperature for Paper Electronics

2019 ◽  
Vol 14 (1) ◽  
Author(s):  
Lixin Mo ◽  
Zhenxin Guo ◽  
Zhenguo Wang ◽  
Li Yang ◽  
Yi Fang ◽  
...  
Keyword(s):  
Sintering Temperature ◽  
High Conductivity ◽  
Nano Silver ◽  
Silver Ink ◽  
Paper Electronics ◽  
Low Sintering Temperature

Enhanced pressureless bonding by Tin Doped Silver Paste at low sintering temperature

2016 ◽  
Vol 660 ◽  
pp. 71-76 ◽  
Author(s):  
Cheng-Xiang Yang ◽  
Xin Li ◽  
Guo-Quan Lu ◽  
Yun-Hui Mei
Keyword(s):  
Sintering Temperature ◽  
Silver Paste ◽  
Low Sintering Temperature

Nano-Silver Paste with a Low Sintering Temperature

2011 ◽  
Vol 391-392 ◽  
pp. 745-748
Author(s):  
Shi Yong Luo ◽  
Juan Chen ◽  
Wen Cai Xu ◽  
Xin Lin Zhang ◽  
Li Xia Huo
Keyword(s):  
Shear Rate ◽  
Screen Printing ◽  
Sintering Temperature ◽  
Acetate Solution ◽  
Ethyl Acetate Solution ◽  
Silver Particles ◽  
Pseudoplastic Fluid ◽  
Nano Silver ◽  
Low Sintering Temperature ◽  
Electrical Components

A paste with as low as 300°C sintering temperature was prepared by using nano silver particles and nitrocellulose ethyl acetate solution. The rheological and thixotropic behaviors of the typical paste were characterized and their effects on the screen printing ability were analyzed in details. The paste demonstrates a typical shear thinning rheological behavior and thixotropic of pseudoplastic fluid. The apparent viscosity decreased rapidly with the increase of the shear rate. The paste is proper for the manufacturing electrical components at a low sintering temperature as low as 300°C.

Fabrication of Pb-Free Silver Paste and Thick Film Adding Silver Nanoparticles

2007 ◽  
Vol 124-126 ◽  
pp. 639-642 ◽  
Author(s):  
Sung Hyun Park ◽  
Dong Seok Seo ◽  
Jong Kook Lee
Keyword(s):  
Silver Nanoparticles ◽  
Screen Printing ◽  
Chemical Reduction ◽  
Silver Powder ◽  
Thick Films ◽  
Electronic Devices ◽  
Average Particle Size ◽  
Average Particle ◽  
Silver Paste ◽  
The Relationship

Fabrication of paste at low temperature has been developed in order to apply for various electronic devices, such as bus electrode and address electrode in PDP, especially for enlargement of a screen size. In this study, nano-sized silver particles with 10 - 30 nm were synthesized from silver nitrate (AgNO3) by a chemical reduction method. To prepare Pb-free silver paste, the silver nanoparticles were mixed with conventional silver powder with an average particle size of 1.6 and conventional Pb-free frit. Thick films were fabricated from silver paste by a screen printing on alumina substrate and the films were fried at temperatures ranging from 550 °C to 600 °C. Microstructures of the fried thick films were analyzed by FE-SEM. Sheet resistivity of fried thick films was measured and also the relationship between sinterability and conductivity of these films were investigated.

Feasibility investigation and characterization of low-pressure-assisted sintered-silver bonded large-area DBA plates

2019 ◽  
Vol 32 (3) ◽  
pp. 129-136 ◽  
Author(s):  
Yansong Tan ◽  
Xin Li ◽  
Xu Chen ◽  
Zhenwen Yang ◽  
Guo-Quan Lu
Keyword(s):  
Shear Strength ◽  
Double Layer ◽  
Low Pressure ◽  
Large Area ◽  
Silver Paste ◽  
Content Type ◽  
Nano Silver ◽  
Average Shear Strength ◽  
Bonding Method ◽  
Sintered Silver

Purpose This paper aims to use nano-silver paste to design a new bonding method for super-large-area direct-bonded-aluminum (DBA) plates. It compared several frequently used bonding methods and proved the feasibility of an optimized low-pressure-assisted double-layer-printed silver sintering technology for large-area bonding to increase the thermal conductivity of power electronic modules with high junction temperature, higher power density and higher reliability. Design/methodology/approach The bonding profile was optimized by using transparent glasses as substrates. Thus, the bonding qualities could be directly characterized by optical observation. After sintering, the bonded DBA samples were characterized by nondestructive X-ray computed tomography system, scanning electron microscopy equipped with an energy dispersive spectrometer. Finally, bonding stress evolution was characterized by shear tests. Findings Low-pressure-assisted large-area double-layer-printed bonding process consisting of six-step was successfully developed to bond DBA substrates with the size of 50.8 × 25.4 mm. The thickness of the sintered-silver bond-line was between 33  and 74 µm with the average porosity of 12.5 per cent. The distribution of shear strength along the length of DBA/DBA bonded sample was from 9.7  to 18.8 MPa, with average shear strength of 15.5 MPa. The typical fracture primarily propagated in the sintered-silver layer and partially along the Ni layer. Research limitations/implications The bonding stress needs to be further improved. Meanwhile, the thermal and electrical properties are encouraged to test further. Practical implications If nano-silver paste can be used as thermal interfacial material for super-large-area bonding, the thermal performance will be improved. Social implications The paper accelerated the use of nano-silver paste for super-large-area DBA bonding. Originality/value The proposed bonding method greatly decreased the bonding pressure.

In vitro and in vivo Assessment of Silver Nanoparticles Against Clostridium botulinum Type A Botulinum

2019 ◽  
Vol 16 (1) ◽  
pp. 113-119 ◽  
Author(s):  
Mohammad Aminianfar ◽  
Siavash Parvardeh ◽  
Mohsen Soleimani
Keyword(s):  
Silver Nanoparticles ◽  
Botulinum Toxin ◽  
Clostridium Botulinum ◽  
Lethal Dose ◽  
Type A ◽  
Positive Control ◽  
Negative Control ◽  
Laboratory Animals ◽  
Control Group ◽  
Nano Silver

Background: Clostridium botulinum causes botulism, a serious paralytic illness that results from the ingestion of a botulinum toxin. Because silver nanoparticle products exhibit strong antimicrobial activity, applications for silver nanoparticles in healthcare have expanded. Therefore, the objective of the current study was to assess a therapeutic strategy for the treatment of botulism toxicity using silver nanoparticles. Methods: A preliminary test was conducted using doses that produce illness in laboratory animals to determine the absolute lethal dose (LD100) of botulinum toxin type A (BoNT/A) in mice. Next, the test animals were divided into six groups containing six mice each. Groups I, II and III were the negative control (botulinum toxin only), positive control-1 (nano-silver only) and positive control-2 (no treatment), respectively. The remaining groups were allocated to the toxin that was supplemented with three nano-silver treatments. Results: The mortality rates of mice caused by BoNT/A significantly reduced in the treatment groups with different doses and injection intervals of nano-silver when compared to the negative control group. BoNT/A toxicity induced by intraperitoneal injection of the toxin of Clostridium botulinum causes rapid death while when coupled with nano-osilver results in delayed death in mice. Conclusion: These results, while open to future improvement, represent a preliminary step towards the satisfactory control of BoNT/A with the use of silver nanoparticles for human protection against this bioterrorism threat. Further study in this area can elucidate the underlying mechanism for detoxifying BoNT/A by silver nanoparticles.

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