GaN nanostructures by reactive ion etching: Mask and Maskless approach

2019 ◽  
Vol 18 ◽  
pp. 100284 ◽  
Author(s):  
Jaya Lohani ◽  
Shivani Varshney ◽  
Dipendra S. Rawal ◽  
Sameer Sapra ◽  
Renu Tyagi
2005 ◽  
Author(s):  
T.C. Lo ◽  
J.S. Zhang ◽  
H.C. Huang ◽  
G.W. Huang ◽  
S. Su ◽  
...  

2006 ◽  
Author(s):  
Huang-Shen Lin ◽  
Chih-Chiang Kao ◽  
Hao-Chung Kuo ◽  
Shing-Chung Wang ◽  
Gong-Ru Lin

2012 ◽  
Vol 542-543 ◽  
pp. 945-948
Author(s):  
Dong Sheng Peng ◽  
Zhi Gang Chen ◽  
Cong Cong Tan

The paper studies the microspheres etching technique, the silicon pillar arrays are fabricated using polystyrene particles as etching mask by Reactive Ion Etching. Obtained the substrate can be Lateral epitaxial. The influence of different parameters in etch process are investigated on silicon pillar arrays in detail. A large-area Si pillar can be obtained on Si substrate by controlling the suitable etch parameters. The approach reported here offers a possibility to product large-area pillar.


1996 ◽  
Author(s):  
George F. McLane ◽  
Paul Cooke ◽  
Robert P. Moerkirk

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