18th IEEE International Conference on Micro Electro Mechanical Systems, 2005. MEMS 2005.
Latest Publications

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238

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Published By IEEE

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Study of injection-locking phenomenon using mems tunable laser

18th IEEE International Conference on Micro Electro Mechanical Systems, 2005. MEMS 2005. ◽

10.1109/memsys.2005.1453872 ◽

2005 ◽

Author(s):

X.M. Zhang ◽

J.B. Zhang ◽

A.Q. Liu ◽

F. Choller ◽

J.Z. Hao

Keyword(s):

Tunable Laser ◽

Injection Locking

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Low motional resistance ring-shaped contour-mode aluminum nitride piezoelectric micromeckanical resonators for UHF applications

18th IEEE International Conference on Micro Electro Mechanical Systems, 2005. MEMS 2005. ◽

10.1109/memsys.2005.1453857 ◽

2005 ◽

Cited By ~ 28

Author(s):

G. Piazza ◽

P.J. Stephanou ◽

J.M. Porter ◽

M.B.J. Wijesundara ◽

A.P. Pisano

Keyword(s):

Aluminum Nitride ◽

Motional Resistance ◽

Contour Mode

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Micromachining of pulsed laser annealed PECVD Si/sub x/Ge/sub 1-x/ deposited at temperatures ≤370°C

18th IEEE International Conference on Micro Electro Mechanical Systems, 2005. MEMS 2005. ◽

10.1109/memsys.2005.1453973 ◽

2005 ◽

Cited By ~ 2

Author(s):

S. Sedky ◽

A. Witvrouw

Keyword(s):

Pulsed Laser

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A two-level prediction model for deep reactive ion etch (DRIE)

18th IEEE International Conference on Micro Electro Mechanical Systems, 2005. MEMS 2005. ◽

10.1109/memsys.2005.1453974 ◽

2005 ◽

Cited By ~ 2

Author(s):

H. Sun ◽

T. Hill ◽

H. Taylor ◽

M. Schmidt ◽

D. Boning

Keyword(s):

Prediction Model

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A MEMS differential calorimeter for biomolecular characterization

18th IEEE International Conference on Micro Electro Mechanical Systems, 2005. MEMS 2005. ◽

10.1109/memsys.2005.1454054 ◽

2005 ◽

Cited By ~ 2

Author(s):

Li Wang ◽

Yongjun Zhao ◽

Eunice Ng ◽

Qiao Lin

Keyword(s):

Differential Calorimeter

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Design, fabrication, and characterization of electrical and fluidic interconnections for a multi-chip microelectrofluidic bench

18th IEEE International Conference on Micro Electro Mechanical Systems, 2005. MEMS 2005. ◽

10.1109/memsys.2005.1454015 ◽

2005 ◽

Author(s):

Sang Do Suk ◽

Sunghwan Chang ◽

Young-Ho Cho

Keyword(s):

Fabrication And Characterization

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Wafer-level vacuum package with vertical feedthroughs

18th IEEE International Conference on Micro Electro Mechanical Systems, 2005. MEMS 2005. ◽

10.1109/memsys.2005.1453988 ◽

2005 ◽

Cited By ~ 8

Author(s):

Junseok Chae ◽

J.M. Giachino ◽

K. Najafi

Keyword(s):

Wafer Level ◽

Vacuum Package

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High-Q integrated inductors on trenched silicon islands

18th IEEE International Conference on Micro Electro Mechanical Systems, 2005. MEMS 2005. ◽

10.1109/memsys.2005.1453901 ◽

2005 ◽

Cited By ~ 11

Author(s):

M. Raieszadeh ◽

P. Monajemi ◽

Sang-Woong Yoon ◽

J. Laskar ◽

F. Ayazi

Keyword(s):

High Q ◽

Integrated Inductors ◽

Silicon Islands

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300nm-thick cantilever in PDMS for tactile sensing

18th IEEE International Conference on Micro Electro Mechanical Systems, 2005. MEMS 2005. ◽

10.1109/memsys.2005.1453922 ◽

2005 ◽

Cited By ~ 3

Author(s):

K. Noda ◽

K. Hashino ◽

K. Matsumoto ◽

I. Shimoyama

Keyword(s):

Tactile Sensing

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Deep reactive ion etching of pyrex glass usingabonded silicon wafer as an etching mask

18th IEEE International Conference on Micro Electro Mechanical Systems, 2005. MEMS 2005. ◽

10.1109/memsys.2005.1453981 ◽

2005 ◽

Cited By ~ 2

Author(s):

T. Akashi ◽

Y. Yoshimura ◽

S. Higashiyama

Keyword(s):

Silicon Wafer ◽

Reactive Ion Etching ◽

Pyrex Glass ◽

Ion Etching ◽

Deep Reactive Ion Etching ◽

Etching Mask

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18th IEEE International Conference on Micro Electro Mechanical Systems, 2005. MEMS 2005.Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Study of injection-locking phenomenon using mems tunable laser

Low motional resistance ring-shaped contour-mode aluminum nitride piezoelectric micromeckanical resonators for UHF applications

Micromachining of pulsed laser annealed PECVD Si/sub x/Ge/sub 1-x/ deposited at temperatures ≤370°C

A two-level prediction model for deep reactive ion etch (DRIE)

A MEMS differential calorimeter for biomolecular characterization

Design, fabrication, and characterization of electrical and fluidic interconnections for a multi-chip microelectrofluidic bench

Wafer-level vacuum package with vertical feedthroughs

High-Q integrated inductors on trenched silicon islands

300nm-thick cantilever in PDMS for tactile sensing

Deep reactive ion etching of pyrex glass usingabonded silicon wafer as an etching mask

18th IEEE International Conference on Micro Electro Mechanical Systems, 2005. MEMS 2005.
Latest Publications