Abstract
Recently, the development trend of multi-module and multi-function in electronic microsystems makes the ever-increasing heat flux problem more serious. In this study, a highly efficient integrated single-phase microchannel cooler with four heat sources is presented for handling the challenges from both working independently of all electronic modules and the high heat flux. Numerical and experimental study are both conducted. By optimizing the structural design and the fabricated process, the presented microchannel cooler has outstanding cooling performance, which contains desired fluid flow distribution, pressure drop, heat transfer and combination thereof. Results reveals uniform coolant flow dissipates four individual heaters independently, and their maximal temperature difference below 4 °C. Beyond this, high heat flux removal (707.6 W/cm2) is realized with extremely low coolant flow rate (45 ml/min), and the maximum temperature rise is less than 60 °C. This study provides a referable solution for the thermal management of multi-module heat source and high heat flux in compact electronic microsystems.
Preparation of hot-rolled potassium doped tungsten (KW) thick plate and performance of KW-Cu monoblock mock-ups under high heat flux testing